Thermal Conductivity and Electromagnetic Interference (EMI) Absorbing Properties of Composite Sheets Composed of Dry Processed Core–Shell Structured Fillers and Silicone Polymers
This paper proposes dual-functional sheets (DFSs) that simultaneously have high thermal conductivity (TC) and electromagnetic interference (EMI) absorbing properties, making them suitable for use in mobile electronics. By adopting a simple but highly efficient dry process for manufacturing core–shel...
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| Format: | Article |
| Language: | English |
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MDPI AG
2020-10-01
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| Series: | Polymers |
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| Online Access: | https://www.mdpi.com/2073-4360/12/10/2318 |
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| author | Hyun-Seok Choi Ji-Won Park Kyung-Sub Lee Sang-Woo Kim Su-Jeong Suh |
| author_facet | Hyun-Seok Choi Ji-Won Park Kyung-Sub Lee Sang-Woo Kim Su-Jeong Suh |
| author_sort | Hyun-Seok Choi |
| collection | DOAJ |
| description | This paper proposes dual-functional sheets (DFSs) that simultaneously have high thermal conductivity (TC) and electromagnetic interference (EMI) absorbing properties, making them suitable for use in mobile electronics. By adopting a simple but highly efficient dry process for manufacturing core–shell structured fillers (CSSFs) and formulating a close-packed filler composition, the DFSs show high performance, TC of 5.1 W m<sup>−1</sup> K<sup>−1</sup>, and a −4 dB inter-decoupling ratio (IDR) at a 1 GHz frequency. Especially, the DFSs show a high dielectric breakdown voltage (BDV) of 3 kV mm<sup>−1</sup>, which is beneficial for application in most electronic devices. The DFSs consist of two kinds of CSSFs that are blended in accordance with the close-packing rule, Horsfield’s packing model, and with polydimethylsiloxane (PDMS) polymers. The core materials are soft magnetic Fe-12.5%Cr and Fe-6.5%Si alloy powders of different sizes, and Al<sub>2</sub>O<sub>3</sub> ceramic powders of a 1-μm diameter are used as the shell material. The high performance of the DFS is supposed to originate from the thick and stable shell layer and the maximized filler loading capability owing to the close-packed structure. |
| first_indexed | 2024-03-10T15:44:30Z |
| format | Article |
| id | doaj.art-8dd50ec0827f42cebd880aa1d5eca96b |
| institution | Directory Open Access Journal |
| issn | 2073-4360 |
| language | English |
| last_indexed | 2024-03-10T15:44:30Z |
| publishDate | 2020-10-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Polymers |
| spelling | doaj.art-8dd50ec0827f42cebd880aa1d5eca96b2023-11-20T16:35:28ZengMDPI AGPolymers2073-43602020-10-011210231810.3390/polym12102318Thermal Conductivity and Electromagnetic Interference (EMI) Absorbing Properties of Composite Sheets Composed of Dry Processed Core–Shell Structured Fillers and Silicone PolymersHyun-Seok Choi0Ji-Won Park1Kyung-Sub Lee2Sang-Woo Kim3Su-Jeong Suh4Advanced Materials Science and Engineering, Sung Kyun Kwan University, Suwon 16419, KoreaR&D Center, JB Lab. Coporation, Seoul 08826, KoreaR&D Center, Nopion Corporation, Suwon 16336, KoreaClean Energy Research Center, Korea Institute of Science and Technology, Seoul 02792, KoreaAdvanced Materials Science and Engineering, Sung Kyun Kwan University, Suwon 16419, KoreaThis paper proposes dual-functional sheets (DFSs) that simultaneously have high thermal conductivity (TC) and electromagnetic interference (EMI) absorbing properties, making them suitable for use in mobile electronics. By adopting a simple but highly efficient dry process for manufacturing core–shell structured fillers (CSSFs) and formulating a close-packed filler composition, the DFSs show high performance, TC of 5.1 W m<sup>−1</sup> K<sup>−1</sup>, and a −4 dB inter-decoupling ratio (IDR) at a 1 GHz frequency. Especially, the DFSs show a high dielectric breakdown voltage (BDV) of 3 kV mm<sup>−1</sup>, which is beneficial for application in most electronic devices. The DFSs consist of two kinds of CSSFs that are blended in accordance with the close-packing rule, Horsfield’s packing model, and with polydimethylsiloxane (PDMS) polymers. The core materials are soft magnetic Fe-12.5%Cr and Fe-6.5%Si alloy powders of different sizes, and Al<sub>2</sub>O<sub>3</sub> ceramic powders of a 1-μm diameter are used as the shell material. The high performance of the DFS is supposed to originate from the thick and stable shell layer and the maximized filler loading capability owing to the close-packed structure.https://www.mdpi.com/2073-4360/12/10/2318dual-functional sheetthermal conductivityinter-decoupling ratiocore–shell structured fillersdielectric breakdown voltage |
| spellingShingle | Hyun-Seok Choi Ji-Won Park Kyung-Sub Lee Sang-Woo Kim Su-Jeong Suh Thermal Conductivity and Electromagnetic Interference (EMI) Absorbing Properties of Composite Sheets Composed of Dry Processed Core–Shell Structured Fillers and Silicone Polymers Polymers dual-functional sheet thermal conductivity inter-decoupling ratio core–shell structured fillers dielectric breakdown voltage |
| title | Thermal Conductivity and Electromagnetic Interference (EMI) Absorbing Properties of Composite Sheets Composed of Dry Processed Core–Shell Structured Fillers and Silicone Polymers |
| title_full | Thermal Conductivity and Electromagnetic Interference (EMI) Absorbing Properties of Composite Sheets Composed of Dry Processed Core–Shell Structured Fillers and Silicone Polymers |
| title_fullStr | Thermal Conductivity and Electromagnetic Interference (EMI) Absorbing Properties of Composite Sheets Composed of Dry Processed Core–Shell Structured Fillers and Silicone Polymers |
| title_full_unstemmed | Thermal Conductivity and Electromagnetic Interference (EMI) Absorbing Properties of Composite Sheets Composed of Dry Processed Core–Shell Structured Fillers and Silicone Polymers |
| title_short | Thermal Conductivity and Electromagnetic Interference (EMI) Absorbing Properties of Composite Sheets Composed of Dry Processed Core–Shell Structured Fillers and Silicone Polymers |
| title_sort | thermal conductivity and electromagnetic interference emi absorbing properties of composite sheets composed of dry processed core shell structured fillers and silicone polymers |
| topic | dual-functional sheet thermal conductivity inter-decoupling ratio core–shell structured fillers dielectric breakdown voltage |
| url | https://www.mdpi.com/2073-4360/12/10/2318 |
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