Structure and electrochemical properties of copper wires with seamless 1D nanostructures
A seamless Cu nanowire array grown on Cu wire is prepared by combining thermal oxidation method and electrochemical reduction. The data set described in this paper includes the structure of the Cu nanowires electrode, electrocatalytic active surface area, linear sweep voltammetry and amperometry mea...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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Elsevier
2018-04-01
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| Series: | Data in Brief |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2352340918301008 |
| _version_ | 1818116367825502208 |
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| author | Yutong Wu Meiqi Gao Song Li Yuping Ren Gaowu Qin |
| author_facet | Yutong Wu Meiqi Gao Song Li Yuping Ren Gaowu Qin |
| author_sort | Yutong Wu |
| collection | DOAJ |
| description | A seamless Cu nanowire array grown on Cu wire is prepared by combining thermal oxidation method and electrochemical reduction. The data set described in this paper includes the structure of the Cu nanowires electrode, electrocatalytic active surface area, linear sweep voltammetry and amperometry measurement for nitrate sensing. The electrochemical data show that Cu nanowire arrays exhibited a linear response to nitrate ions over a concentration range from 50 μM to 600 μM (R2 = 0.9974) with a sensitivity of 0.357 μA μM−1 cm−1 and detection limit of 12.2 μM at a signal-to-noise ratio of 3, respectively. |
| first_indexed | 2024-12-11T04:21:24Z |
| format | Article |
| id | doaj.art-8df8929397ba4085b0062e18c017c538 |
| institution | Directory Open Access Journal |
| issn | 2352-3409 |
| language | English |
| last_indexed | 2024-12-11T04:21:24Z |
| publishDate | 2018-04-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Data in Brief |
| spelling | doaj.art-8df8929397ba4085b0062e18c017c5382022-12-22T01:21:05ZengElsevierData in Brief2352-34092018-04-0117747752Structure and electrochemical properties of copper wires with seamless 1D nanostructuresYutong Wu0Meiqi Gao1Song Li2Yuping Ren3Gaowu Qin4School of Materials Science and Engineering, Northeastern University, Shenyang 110819, ChinaSchool of Materials Science and Engineering, Northeastern University, Shenyang 110819, ChinaCorresponding author.; School of Materials Science and Engineering, Northeastern University, Shenyang 110819, ChinaSchool of Materials Science and Engineering, Northeastern University, Shenyang 110819, ChinaSchool of Materials Science and Engineering, Northeastern University, Shenyang 110819, ChinaA seamless Cu nanowire array grown on Cu wire is prepared by combining thermal oxidation method and electrochemical reduction. The data set described in this paper includes the structure of the Cu nanowires electrode, electrocatalytic active surface area, linear sweep voltammetry and amperometry measurement for nitrate sensing. The electrochemical data show that Cu nanowire arrays exhibited a linear response to nitrate ions over a concentration range from 50 μM to 600 μM (R2 = 0.9974) with a sensitivity of 0.357 μA μM−1 cm−1 and detection limit of 12.2 μM at a signal-to-noise ratio of 3, respectively.http://www.sciencedirect.com/science/article/pii/S2352340918301008 |
| spellingShingle | Yutong Wu Meiqi Gao Song Li Yuping Ren Gaowu Qin Structure and electrochemical properties of copper wires with seamless 1D nanostructures Data in Brief |
| title | Structure and electrochemical properties of copper wires with seamless 1D nanostructures |
| title_full | Structure and electrochemical properties of copper wires with seamless 1D nanostructures |
| title_fullStr | Structure and electrochemical properties of copper wires with seamless 1D nanostructures |
| title_full_unstemmed | Structure and electrochemical properties of copper wires with seamless 1D nanostructures |
| title_short | Structure and electrochemical properties of copper wires with seamless 1D nanostructures |
| title_sort | structure and electrochemical properties of copper wires with seamless 1d nanostructures |
| url | http://www.sciencedirect.com/science/article/pii/S2352340918301008 |
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