Facile Preparation of Monodisperse Cu@Ag Core–Shell Nanoparticles for Conductive Ink in Printing Electronics
Copper-based nanoinks are emerging as promising low-cost alternatives to widely used silver nanoinks in electronic printing. However, the spontaneous oxidation of copper under ambient conditions poses significant challenges to its broader application. To address this issue, this paper presents an ec...
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| Format: | Article |
| Language: | English |
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MDPI AG
2023-06-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/14/7/1318 |
| _version_ | 1827732402891390976 |
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| author | Gang Li Xuecheng Yu Ruoyu Zhang Qionglin Ouyang Rong Sun Liqiang Cao Pengli Zhu |
| author_facet | Gang Li Xuecheng Yu Ruoyu Zhang Qionglin Ouyang Rong Sun Liqiang Cao Pengli Zhu |
| author_sort | Gang Li |
| collection | DOAJ |
| description | Copper-based nanoinks are emerging as promising low-cost alternatives to widely used silver nanoinks in electronic printing. However, the spontaneous oxidation of copper under ambient conditions poses significant challenges to its broader application. To address this issue, this paper presents an economical, large-scale, and environmentally friendly method for fabricating Cu@Ag nanoparticles (Cu@Ag NPs). The as-prepared nanoparticles exhibit a narrow size distribution of approximately 100 nm and can withstand ambient exposure for at least 60 days without significant oxidation. The Cu@Ag-based ink, with a 60 wt% loading, was screen-printed onto a flexible polyimide substrate and subsequently heat-treated at 290 °C for 15 minutes under a nitrogen atmosphere. The sintered pattern displayed a low electrical resistivity of 25.5 μΩ·cm (approximately 15 times the resistivity of bulk copper) along with excellent reliability and mechanical fatigue strength. The innovative Cu@Ag NPs fabrication method holds considerable potential for advancing large-scale applications of copper-based inks in flexible electronics. |
| first_indexed | 2024-03-11T00:50:00Z |
| format | Article |
| id | doaj.art-8e0abf265b4044498e302a1b74034a62 |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-11T00:50:00Z |
| publishDate | 2023-06-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-8e0abf265b4044498e302a1b74034a622023-11-18T20:31:44ZengMDPI AGMicromachines2072-666X2023-06-01147131810.3390/mi14071318Facile Preparation of Monodisperse Cu@Ag Core–Shell Nanoparticles for Conductive Ink in Printing ElectronicsGang Li0Xuecheng Yu1Ruoyu Zhang2Qionglin Ouyang3Rong Sun4Liqiang Cao5Pengli Zhu6System Packaging and Integration Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, ChinaShenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, ChinaShenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, ChinaShenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, ChinaShenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, ChinaSystem Packaging and Integration Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, ChinaUniversity of Chinese Academy of Sciences, Beijing 100049, ChinaCopper-based nanoinks are emerging as promising low-cost alternatives to widely used silver nanoinks in electronic printing. However, the spontaneous oxidation of copper under ambient conditions poses significant challenges to its broader application. To address this issue, this paper presents an economical, large-scale, and environmentally friendly method for fabricating Cu@Ag nanoparticles (Cu@Ag NPs). The as-prepared nanoparticles exhibit a narrow size distribution of approximately 100 nm and can withstand ambient exposure for at least 60 days without significant oxidation. The Cu@Ag-based ink, with a 60 wt% loading, was screen-printed onto a flexible polyimide substrate and subsequently heat-treated at 290 °C for 15 minutes under a nitrogen atmosphere. The sintered pattern displayed a low electrical resistivity of 25.5 μΩ·cm (approximately 15 times the resistivity of bulk copper) along with excellent reliability and mechanical fatigue strength. The innovative Cu@Ag NPs fabrication method holds considerable potential for advancing large-scale applications of copper-based inks in flexible electronics.https://www.mdpi.com/2072-666X/14/7/1318core–shell nanoparticlesantioxidationconductive inkprinting electronics |
| spellingShingle | Gang Li Xuecheng Yu Ruoyu Zhang Qionglin Ouyang Rong Sun Liqiang Cao Pengli Zhu Facile Preparation of Monodisperse Cu@Ag Core–Shell Nanoparticles for Conductive Ink in Printing Electronics Micromachines core–shell nanoparticles antioxidation conductive ink printing electronics |
| title | Facile Preparation of Monodisperse Cu@Ag Core–Shell Nanoparticles for Conductive Ink in Printing Electronics |
| title_full | Facile Preparation of Monodisperse Cu@Ag Core–Shell Nanoparticles for Conductive Ink in Printing Electronics |
| title_fullStr | Facile Preparation of Monodisperse Cu@Ag Core–Shell Nanoparticles for Conductive Ink in Printing Electronics |
| title_full_unstemmed | Facile Preparation of Monodisperse Cu@Ag Core–Shell Nanoparticles for Conductive Ink in Printing Electronics |
| title_short | Facile Preparation of Monodisperse Cu@Ag Core–Shell Nanoparticles for Conductive Ink in Printing Electronics |
| title_sort | facile preparation of monodisperse cu ag core shell nanoparticles for conductive ink in printing electronics |
| topic | core–shell nanoparticles antioxidation conductive ink printing electronics |
| url | https://www.mdpi.com/2072-666X/14/7/1318 |
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