Self-assembled monolayer of designed and synthesized triazinedithiolsilane molecule as interfacial adhesion enhancer for integrated circuit

<p>Abstract</p> <p>Self-assembled monolayer (SAM) with tunable surface chemistry and smooth surface provides an approach to adhesion improvement and suppressing deleterious chemical interactions. Here, we demonstrate the SAM comprising of designed and synthesized 6-(3-triethoxysily...

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Main Authors: Wang Fang, Li Yanni, Wang Yabin, Cao Zhuo
Format: Article
Language:English
Published: SpringerOpen 2011-01-01
Series:Nanoscale Research Letters
Subjects:
Online Access:http://www.nanoscalereslett.com/content/6/1/483
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author Wang Fang
Li Yanni
Wang Yabin
Cao Zhuo
author_facet Wang Fang
Li Yanni
Wang Yabin
Cao Zhuo
author_sort Wang Fang
collection DOAJ
description <p>Abstract</p> <p>Self-assembled monolayer (SAM) with tunable surface chemistry and smooth surface provides an approach to adhesion improvement and suppressing deleterious chemical interactions. Here, we demonstrate the SAM comprising of designed and synthesized 6-(3-triethoxysilylpropyl)amino-1,3,5-triazine-2,4-dithiol molecule, which can enhance interfacial adhesion to inhibit copper diffusion used in device metallization. The formation of the triazinedithiolsilane SAM is confirmed by X-ray photoelectron spectroscopy. The adhesion strength between SAM-coated substrate and electroless deposition copper film was up to 13.8 MPa. The design strategy of triazinedithiolsilane molecule is expected to open up the possibilities for replacing traditional organosilane to be applied in microelectronic industry.</p>
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spelling doaj.art-8f3c3f2fb1344c76998c225b34cc7b242023-08-02T04:12:06ZengSpringerOpenNanoscale Research Letters1931-75731556-276X2011-01-0161483Self-assembled monolayer of designed and synthesized triazinedithiolsilane molecule as interfacial adhesion enhancer for integrated circuitWang FangLi YanniWang YabinCao Zhuo<p>Abstract</p> <p>Self-assembled monolayer (SAM) with tunable surface chemistry and smooth surface provides an approach to adhesion improvement and suppressing deleterious chemical interactions. Here, we demonstrate the SAM comprising of designed and synthesized 6-(3-triethoxysilylpropyl)amino-1,3,5-triazine-2,4-dithiol molecule, which can enhance interfacial adhesion to inhibit copper diffusion used in device metallization. The formation of the triazinedithiolsilane SAM is confirmed by X-ray photoelectron spectroscopy. The adhesion strength between SAM-coated substrate and electroless deposition copper film was up to 13.8 MPa. The design strategy of triazinedithiolsilane molecule is expected to open up the possibilities for replacing traditional organosilane to be applied in microelectronic industry.</p>http://www.nanoscalereslett.com/content/6/1/483adhesioncopperdiffusion barrierself-assembled monolayersurface chemistry
spellingShingle Wang Fang
Li Yanni
Wang Yabin
Cao Zhuo
Self-assembled monolayer of designed and synthesized triazinedithiolsilane molecule as interfacial adhesion enhancer for integrated circuit
Nanoscale Research Letters
adhesion
copper
diffusion barrier
self-assembled monolayer
surface chemistry
title Self-assembled monolayer of designed and synthesized triazinedithiolsilane molecule as interfacial adhesion enhancer for integrated circuit
title_full Self-assembled monolayer of designed and synthesized triazinedithiolsilane molecule as interfacial adhesion enhancer for integrated circuit
title_fullStr Self-assembled monolayer of designed and synthesized triazinedithiolsilane molecule as interfacial adhesion enhancer for integrated circuit
title_full_unstemmed Self-assembled monolayer of designed and synthesized triazinedithiolsilane molecule as interfacial adhesion enhancer for integrated circuit
title_short Self-assembled monolayer of designed and synthesized triazinedithiolsilane molecule as interfacial adhesion enhancer for integrated circuit
title_sort self assembled monolayer of designed and synthesized triazinedithiolsilane molecule as interfacial adhesion enhancer for integrated circuit
topic adhesion
copper
diffusion barrier
self-assembled monolayer
surface chemistry
url http://www.nanoscalereslett.com/content/6/1/483
work_keys_str_mv AT wangfang selfassembledmonolayerofdesignedandsynthesizedtriazinedithiolsilanemoleculeasinterfacialadhesionenhancerforintegratedcircuit
AT liyanni selfassembledmonolayerofdesignedandsynthesizedtriazinedithiolsilanemoleculeasinterfacialadhesionenhancerforintegratedcircuit
AT wangyabin selfassembledmonolayerofdesignedandsynthesizedtriazinedithiolsilanemoleculeasinterfacialadhesionenhancerforintegratedcircuit
AT caozhuo selfassembledmonolayerofdesignedandsynthesizedtriazinedithiolsilanemoleculeasinterfacialadhesionenhancerforintegratedcircuit