Fuzzy Approach for Reliability Modeling of Lead-Free Solder Joints in Elevated Temperature Environmental Conditions
The mechanical and fatigue properties of microelectronic interconnection materials are important issues in critical applications in the life of electronic assemblies. Due to the growth in the applications of electronic components in new technological products used in tough conditions, evaluating the...
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| Format: | Article |
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MDPI AG
2022-05-01
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| Online Access: | https://www.mdpi.com/2073-4352/12/6/775 |
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| author | Raed Al Athamneh Mohammed Abueed Dania Bani Hani Sa’d Hamasha |
| author_facet | Raed Al Athamneh Mohammed Abueed Dania Bani Hani Sa’d Hamasha |
| author_sort | Raed Al Athamneh |
| collection | DOAJ |
| description | The mechanical and fatigue properties of microelectronic interconnection materials are important issues in critical applications in the life of electronic assemblies. Due to the growth in the applications of electronic components in new technological products used in tough conditions, evaluating the reliability of solder alloys has become crucial to the prediction of product life. SAC (Sn-Ag-Cu) solder alloys are common lead-free alloys used to form solder joints. In the current study, the reliability of individual SAC305 solder joints in actual setting conditions with an organic solderability preservative (OSP) surface finish was examined using an accelerated shear fatigue test at different load levels (16 MPa, 20 MPa, and 24 MPa). Four operating temperature levels (−10, 25, 60, and 100 °C) were also used. Seven samples were utilized at each experimental condition. An orthogonal array (L12) was employed for this experiment. The fatigue behavior of the SAC305 solder joints in actual setting conditions was described by a two-parameter Weibull distribution. The characteristic life and the shape parameter were extrapolated from the Weibull distribution for each experimental condition. Characteristic life was employed to represent the fatigue resistance of the solder joints. For each sample, the inelastic work per cycle and plastic deformation were determined. The results indicated a notable increase in the inelastic work per cycle and the plastic strain as a result of increasing either the stress load or the working temperature. Combinations of stress amplitude, working temperature, inelastic work, and plastic deformation were applied as inputs to the fuzzy system for computing a comprehensive output measure (COM-Value) using the Mamdani method. A negative relationship was observed between the solder life and the four fuzzy inputs. To fuzzify the inputs of the fuzzy system, two membership functions, “MFs”, were formed for each input, and five MFs were set for the output. The center-of-gravity (COG) theorem was utilized as a defuzzification method in the fuzzy inference system. The characteristic life of the solder joints was predicted by the COM-Value, which was used as an independent variable. Finally, The COM-Value was used to generate a general predicted reliability model for SAC305 solder joints with an acceptable model adequacy index. |
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| language | English |
| last_indexed | 2024-03-10T00:04:26Z |
| publishDate | 2022-05-01 |
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| spelling | doaj.art-8fba4ddab2d443c8b98cea1cba240e402023-11-23T16:11:38ZengMDPI AGCrystals2073-43522022-05-0112677510.3390/cryst12060775Fuzzy Approach for Reliability Modeling of Lead-Free Solder Joints in Elevated Temperature Environmental ConditionsRaed Al Athamneh0Mohammed Abueed1Dania Bani Hani2Sa’d Hamasha3Department of Industrial Engineering, Faculty of Engineering, The Hashemite University, P.O. Box 330127, Zarqa 13133, JordanDepartment of Industrial and System Engineering, Samuel Ginn College of Engineering, Auburn University, Auburn, AL 36849, USADepartment of Industrial Engineering, Hijjawi Faculty for Engineering Technology, Yarmouk University, Irbid 21163, JordanDepartment of Industrial and System Engineering, Samuel Ginn College of Engineering, Auburn University, Auburn, AL 36849, USAThe mechanical and fatigue properties of microelectronic interconnection materials are important issues in critical applications in the life of electronic assemblies. Due to the growth in the applications of electronic components in new technological products used in tough conditions, evaluating the reliability of solder alloys has become crucial to the prediction of product life. SAC (Sn-Ag-Cu) solder alloys are common lead-free alloys used to form solder joints. In the current study, the reliability of individual SAC305 solder joints in actual setting conditions with an organic solderability preservative (OSP) surface finish was examined using an accelerated shear fatigue test at different load levels (16 MPa, 20 MPa, and 24 MPa). Four operating temperature levels (−10, 25, 60, and 100 °C) were also used. Seven samples were utilized at each experimental condition. An orthogonal array (L12) was employed for this experiment. The fatigue behavior of the SAC305 solder joints in actual setting conditions was described by a two-parameter Weibull distribution. The characteristic life and the shape parameter were extrapolated from the Weibull distribution for each experimental condition. Characteristic life was employed to represent the fatigue resistance of the solder joints. For each sample, the inelastic work per cycle and plastic deformation were determined. The results indicated a notable increase in the inelastic work per cycle and the plastic strain as a result of increasing either the stress load or the working temperature. Combinations of stress amplitude, working temperature, inelastic work, and plastic deformation were applied as inputs to the fuzzy system for computing a comprehensive output measure (COM-Value) using the Mamdani method. A negative relationship was observed between the solder life and the four fuzzy inputs. To fuzzify the inputs of the fuzzy system, two membership functions, “MFs”, were formed for each input, and five MFs were set for the output. The center-of-gravity (COG) theorem was utilized as a defuzzification method in the fuzzy inference system. The characteristic life of the solder joints was predicted by the COM-Value, which was used as an independent variable. Finally, The COM-Value was used to generate a general predicted reliability model for SAC305 solder joints with an acceptable model adequacy index.https://www.mdpi.com/2073-4352/12/6/775fuzzysolder jointslead-freereliability |
| spellingShingle | Raed Al Athamneh Mohammed Abueed Dania Bani Hani Sa’d Hamasha Fuzzy Approach for Reliability Modeling of Lead-Free Solder Joints in Elevated Temperature Environmental Conditions Crystals fuzzy solder joints lead-free reliability |
| title | Fuzzy Approach for Reliability Modeling of Lead-Free Solder Joints in Elevated Temperature Environmental Conditions |
| title_full | Fuzzy Approach for Reliability Modeling of Lead-Free Solder Joints in Elevated Temperature Environmental Conditions |
| title_fullStr | Fuzzy Approach for Reliability Modeling of Lead-Free Solder Joints in Elevated Temperature Environmental Conditions |
| title_full_unstemmed | Fuzzy Approach for Reliability Modeling of Lead-Free Solder Joints in Elevated Temperature Environmental Conditions |
| title_short | Fuzzy Approach for Reliability Modeling of Lead-Free Solder Joints in Elevated Temperature Environmental Conditions |
| title_sort | fuzzy approach for reliability modeling of lead free solder joints in elevated temperature environmental conditions |
| topic | fuzzy solder joints lead-free reliability |
| url | https://www.mdpi.com/2073-4352/12/6/775 |
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