Splitting Opaque, Brittle Materials with Dual-Sided Thermal Stress Using Thermal-Controlled Fracture Method by Microwave
The thermal-controlled fracture method has been increasingly focused upon in the high-quality splitting of advanced brittle materials due to its excellent characteristics related to the fact that it does not remove material. For opaque, brittle materials, their poor fracture quality and low machinin...
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| Language: | English |
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MDPI AG
2022-06-01
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| Series: | Crystals |
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| Online Access: | https://www.mdpi.com/2073-4352/12/6/801 |
| _version_ | 1797488522944315392 |
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| author | Xiaoliang Cheng Zongyang He Hailong Wang Yang Wang |
| author_facet | Xiaoliang Cheng Zongyang He Hailong Wang Yang Wang |
| author_sort | Xiaoliang Cheng |
| collection | DOAJ |
| description | The thermal-controlled fracture method has been increasingly focused upon in the high-quality splitting of advanced brittle materials due to its excellent characteristics related to the fact that it does not remove material. For opaque, brittle materials, their poor fracture quality and low machining capacity resulting from their single-sided heat mode is a bottleneck problem at present. This work proposed the use of dual-sided thermal stress induced by microwave to split opaque, brittle materials. The experimental results indicate that the machining capacity of this method is more than twice that of the single-sided heat mode, and the fracture quality in splitting opaque, brittle materials was significantly improved by dual-sided thermal stress. A microwave cutting experiment was carried out to investigate the distribution characteristic of fracture quality by using different workpiece thicknesses and processing parameters. A dual-sided thermal stress cutting model was established to calculate the temperature field and thermal stress field and was used to simulate the crack propagation behaviors. The accuracy of the simulation model was verified using temperature measurement experiments. The improvement mechanism of the machining capacity and fracture quality of this method was revealed using the fracture mechanics theory based on calculation results from a simulation. This study provides an innovative and feasible method for cutting opaque, brittle materials with promising fracture quality and machining capacity for industrial application. |
| first_indexed | 2024-03-10T00:03:24Z |
| format | Article |
| id | doaj.art-904c0a9b82d74f00ba5d313ae818fdff |
| institution | Directory Open Access Journal |
| issn | 2073-4352 |
| language | English |
| last_indexed | 2024-03-10T00:03:24Z |
| publishDate | 2022-06-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Crystals |
| spelling | doaj.art-904c0a9b82d74f00ba5d313ae818fdff2023-11-23T16:12:06ZengMDPI AGCrystals2073-43522022-06-0112680110.3390/cryst12060801Splitting Opaque, Brittle Materials with Dual-Sided Thermal Stress Using Thermal-Controlled Fracture Method by MicrowaveXiaoliang Cheng0Zongyang He1Hailong Wang2Yang Wang3School of Mechanical Engineering, Anhui Polytechnic University, Wuhu 241000, ChinaSchool of Mechatronics Engineering, Harbin Institute of Technology, Harbin 150001, ChinaSchool of Mechatronics Engineering, Harbin Institute of Technology, Harbin 150001, ChinaSchool of Mechatronics Engineering, Harbin Institute of Technology, Harbin 150001, ChinaThe thermal-controlled fracture method has been increasingly focused upon in the high-quality splitting of advanced brittle materials due to its excellent characteristics related to the fact that it does not remove material. For opaque, brittle materials, their poor fracture quality and low machining capacity resulting from their single-sided heat mode is a bottleneck problem at present. This work proposed the use of dual-sided thermal stress induced by microwave to split opaque, brittle materials. The experimental results indicate that the machining capacity of this method is more than twice that of the single-sided heat mode, and the fracture quality in splitting opaque, brittle materials was significantly improved by dual-sided thermal stress. A microwave cutting experiment was carried out to investigate the distribution characteristic of fracture quality by using different workpiece thicknesses and processing parameters. A dual-sided thermal stress cutting model was established to calculate the temperature field and thermal stress field and was used to simulate the crack propagation behaviors. The accuracy of the simulation model was verified using temperature measurement experiments. The improvement mechanism of the machining capacity and fracture quality of this method was revealed using the fracture mechanics theory based on calculation results from a simulation. This study provides an innovative and feasible method for cutting opaque, brittle materials with promising fracture quality and machining capacity for industrial application.https://www.mdpi.com/2073-4352/12/6/801opaquebrittle materialsthermal-controlled fracture methoddual-sided thermal stressmicrowave cuttingmachining capacity |
| spellingShingle | Xiaoliang Cheng Zongyang He Hailong Wang Yang Wang Splitting Opaque, Brittle Materials with Dual-Sided Thermal Stress Using Thermal-Controlled Fracture Method by Microwave Crystals opaque brittle materials thermal-controlled fracture method dual-sided thermal stress microwave cutting machining capacity |
| title | Splitting Opaque, Brittle Materials with Dual-Sided Thermal Stress Using Thermal-Controlled Fracture Method by Microwave |
| title_full | Splitting Opaque, Brittle Materials with Dual-Sided Thermal Stress Using Thermal-Controlled Fracture Method by Microwave |
| title_fullStr | Splitting Opaque, Brittle Materials with Dual-Sided Thermal Stress Using Thermal-Controlled Fracture Method by Microwave |
| title_full_unstemmed | Splitting Opaque, Brittle Materials with Dual-Sided Thermal Stress Using Thermal-Controlled Fracture Method by Microwave |
| title_short | Splitting Opaque, Brittle Materials with Dual-Sided Thermal Stress Using Thermal-Controlled Fracture Method by Microwave |
| title_sort | splitting opaque brittle materials with dual sided thermal stress using thermal controlled fracture method by microwave |
| topic | opaque brittle materials thermal-controlled fracture method dual-sided thermal stress microwave cutting machining capacity |
| url | https://www.mdpi.com/2073-4352/12/6/801 |
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