Exploring Strategies to Contact 3D Nano-Pillars

Exploring Strategies to Contact 3D Nano-Pillars

This contribution explores different strategies to electrically contact vertical pillars with diameters less than 100 nm. Two process strategies have been defined, the first based on Atomic Force Microscope (AFM) indentation and the second based on planarization and reactive ion etching (RIE). We ha...

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Bibliographic Details
Main Authors: Esteve Amat, Alberto del Moral, Marta Fernández-Regúlez, Laura Evangelio, Matteo Lorenzoni, Ahmed Gharbi, Guido Rademaker, Marie-Line Pourteau, Raluca Tiron, Joan Bausells, Francesc Perez-Murano
Format: Article
Language:English
Published: MDPI AG 2020-04-01
Series:Nanomaterials
Subjects:
vertical pillars
AFM
HSQ
nano-indentation
Online Access:https://www.mdpi.com/2079-4991/10/4/716
Description
Summary:This contribution explores different strategies to electrically contact vertical pillars with diameters less than 100 nm. Two process strategies have been defined, the first based on Atomic Force Microscope (AFM) indentation and the second based on planarization and reactive ion etching (RIE). We have demonstrated that both proposals provide suitable contacts. The results help to conclude that the most feasible strategy to be implementable is the one using planarization and reactive ion etching since it is more suitable for parallel and/or high-volume manufacturing processing.
ISSN:2079-4991

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