Nanoscale patterning of a self-assembled monolayer by modification of the molecule–substrate bond
The intercalation of Cu at the interface of a self-assembled monolayer (SAM) and a Au(111)/mica substrate by underpotential deposition (UPD) is studied as a means of high resolution patterning. A SAM of 2-(4'-methylbiphenyl-4-yl)ethanethiol (BP2) prepared in a structural phase that renders the...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
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Beilstein-Institut
2014-03-01
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| Series: | Beilstein Journal of Nanotechnology |
| Subjects: | |
| Online Access: | https://doi.org/10.3762/bjnano.5.28 |
| _version_ | 1798045658804912128 |
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| author | Cai Shen Manfred Buck |
| author_facet | Cai Shen Manfred Buck |
| author_sort | Cai Shen |
| collection | DOAJ |
| description | The intercalation of Cu at the interface of a self-assembled monolayer (SAM) and a Au(111)/mica substrate by underpotential deposition (UPD) is studied as a means of high resolution patterning. A SAM of 2-(4'-methylbiphenyl-4-yl)ethanethiol (BP2) prepared in a structural phase that renders the Au substrate completely passive against Cu-UPD, is patterned by modification with the tip of a scanning tunneling microscope. The tip-induced defects act as nucleation sites for Cu-UPD. The lateral diffusion of the metal at the SAM–substrate interface and, thus, the pattern dimensions are controlled by the deposition time. Patterning down to the sub-20 nm range is demonstrated. The difference in strength between the S–Au and S–Cu bond is harnessed to develop the latent Cu-UPD image into a patterned binary SAM. Demonstrated by the exchange of BP2 by adamantanethiol (AdSH) this is accomplished by a sequence of reductive desorption of BP2 in Cu free areas followed by adsorption of AdSH. The appearance of Au adatom islands upon the thiol exchange suggests that the interfacial structures of BP2 and AdSH SAMs are different. |
| first_indexed | 2024-04-11T23:24:34Z |
| format | Article |
| id | doaj.art-91d2dec6a2904f2eaa73e9ecb503134e |
| institution | Directory Open Access Journal |
| issn | 2190-4286 |
| language | English |
| last_indexed | 2024-04-11T23:24:34Z |
| publishDate | 2014-03-01 |
| publisher | Beilstein-Institut |
| record_format | Article |
| series | Beilstein Journal of Nanotechnology |
| spelling | doaj.art-91d2dec6a2904f2eaa73e9ecb503134e2022-12-22T03:57:21ZengBeilstein-InstitutBeilstein Journal of Nanotechnology2190-42862014-03-015125826710.3762/bjnano.5.282190-4286-5-28Nanoscale patterning of a self-assembled monolayer by modification of the molecule–substrate bondCai Shen0Manfred Buck1EaStCHEM School of Chemistry, University of St Andrews, St Andrews KY16 9ST, United KingdomEaStCHEM School of Chemistry, University of St Andrews, St Andrews KY16 9ST, United KingdomThe intercalation of Cu at the interface of a self-assembled monolayer (SAM) and a Au(111)/mica substrate by underpotential deposition (UPD) is studied as a means of high resolution patterning. A SAM of 2-(4'-methylbiphenyl-4-yl)ethanethiol (BP2) prepared in a structural phase that renders the Au substrate completely passive against Cu-UPD, is patterned by modification with the tip of a scanning tunneling microscope. The tip-induced defects act as nucleation sites for Cu-UPD. The lateral diffusion of the metal at the SAM–substrate interface and, thus, the pattern dimensions are controlled by the deposition time. Patterning down to the sub-20 nm range is demonstrated. The difference in strength between the S–Au and S–Cu bond is harnessed to develop the latent Cu-UPD image into a patterned binary SAM. Demonstrated by the exchange of BP2 by adamantanethiol (AdSH) this is accomplished by a sequence of reductive desorption of BP2 in Cu free areas followed by adsorption of AdSH. The appearance of Au adatom islands upon the thiol exchange suggests that the interfacial structures of BP2 and AdSH SAMs are different.https://doi.org/10.3762/bjnano.5.28copperelectrodepositiongold adatomsnanolithographynegative resist |
| spellingShingle | Cai Shen Manfred Buck Nanoscale patterning of a self-assembled monolayer by modification of the molecule–substrate bond Beilstein Journal of Nanotechnology copper electrodeposition gold adatoms nanolithography negative resist |
| title | Nanoscale patterning of a self-assembled monolayer by modification of the molecule–substrate bond |
| title_full | Nanoscale patterning of a self-assembled monolayer by modification of the molecule–substrate bond |
| title_fullStr | Nanoscale patterning of a self-assembled monolayer by modification of the molecule–substrate bond |
| title_full_unstemmed | Nanoscale patterning of a self-assembled monolayer by modification of the molecule–substrate bond |
| title_short | Nanoscale patterning of a self-assembled monolayer by modification of the molecule–substrate bond |
| title_sort | nanoscale patterning of a self assembled monolayer by modification of the molecule substrate bond |
| topic | copper electrodeposition gold adatoms nanolithography negative resist |
| url | https://doi.org/10.3762/bjnano.5.28 |
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