Simulation and experimental study of single-crystal silicon laser assisted cutting based on SPH method

Simulation and experimental study of single-crystal silicon laser assisted cutting based on SPH method

Fine cracks are easy to occur in the processing of monocrystalline silicon, which affects the surface processing quality. Laser assisted machining (LAM) can soften the substitute machining area, effectively reduce the cutting force, extend the tool life and improve the surface quality. In this paper...

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Bibliographic Details
Main Authors: Fenping HUANG, Xiayun SHU, Weijing XU, Xuefeng CHANG
Format: Article
Language:zho
Published: Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd. 2023-12-01
Series:Jin'gangshi yu moliao moju gongcheng
Subjects:
sph
monocrystalline silicon
ultra-precision machining
laser assisted
Online Access:http://www.jgszz.cn/article/doi/10.13394/j.cnki.jgszz.2023.0025

Internet

http://www.jgszz.cn/article/doi/10.13394/j.cnki.jgszz.2023.0025

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