The Investigation of the Effect of Filler Sizes in 3D-BN Skeletons on Thermal Conductivity of Epoxy-Based Composites
Thermally conductive and electrically insulating materials have attracted much attention due to their applications in the field of microelectronics, but through-plane thermal conductivity of materials is still low at present. In this paper, a simple and environmentally friendly strategy is proposed...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-01-01
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| Series: | Nanomaterials |
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| Online Access: | https://www.mdpi.com/2079-4991/12/3/446 |
| _version_ | 1797485841859215360 |
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| author | Zhengdong Wang Tong Zhang Jinkai Wang Ganqiu Yang Mengli Li Guanglei Wu |
| author_facet | Zhengdong Wang Tong Zhang Jinkai Wang Ganqiu Yang Mengli Li Guanglei Wu |
| author_sort | Zhengdong Wang |
| collection | DOAJ |
| description | Thermally conductive and electrically insulating materials have attracted much attention due to their applications in the field of microelectronics, but through-plane thermal conductivity of materials is still low at present. In this paper, a simple and environmentally friendly strategy is proposed to improve the through-plane thermal conductivity of epoxy composites using a 3D boron nitride (3D-BN) framework. In addition, the effect of filler sizes in 3D-BN skeletons on thermal conductivity was investigated. The epoxy composite with larger BN in lateral size showed a higher through-plane thermal conductivity of 2.01 W/m·K and maintained a low dielectric constant of 3.7 and a dielectric loss of 0.006 at 50 Hz, making it desirable for the application in microelectronic devices. |
| first_indexed | 2024-03-09T23:24:38Z |
| format | Article |
| id | doaj.art-92a3ed975b2e4212b04872ef1df5eaa6 |
| institution | Directory Open Access Journal |
| issn | 2079-4991 |
| language | English |
| last_indexed | 2024-03-09T23:24:38Z |
| publishDate | 2022-01-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Nanomaterials |
| spelling | doaj.art-92a3ed975b2e4212b04872ef1df5eaa62023-11-23T17:20:56ZengMDPI AGNanomaterials2079-49912022-01-0112344610.3390/nano12030446The Investigation of the Effect of Filler Sizes in 3D-BN Skeletons on Thermal Conductivity of Epoxy-Based CompositesZhengdong Wang0Tong Zhang1Jinkai Wang2Ganqiu Yang3Mengli Li4Guanglei Wu5School of Mechanical and Electrical Engineering, Xi’an University of Architecture and Technology, Xi’an 710055, ChinaSchool of Mechanical and Electrical Engineering, Xi’an University of Architecture and Technology, Xi’an 710055, ChinaSchool of Mechanical and Electrical Engineering, Xi’an University of Architecture and Technology, Xi’an 710055, ChinaSchool of Mechanical and Electrical Engineering, Xi’an University of Architecture and Technology, Xi’an 710055, ChinaSchool of Mechanical and Electrical Engineering, Xi’an University of Architecture and Technology, Xi’an 710055, ChinaState Key Laboratory of Bio-Fibers and Eco-Textiles, Institute of Materials for Energy and Environment, College of Materials Science and Engineering, Qingdao University, Qingdao 266071, ChinaThermally conductive and electrically insulating materials have attracted much attention due to their applications in the field of microelectronics, but through-plane thermal conductivity of materials is still low at present. In this paper, a simple and environmentally friendly strategy is proposed to improve the through-plane thermal conductivity of epoxy composites using a 3D boron nitride (3D-BN) framework. In addition, the effect of filler sizes in 3D-BN skeletons on thermal conductivity was investigated. The epoxy composite with larger BN in lateral size showed a higher through-plane thermal conductivity of 2.01 W/m·K and maintained a low dielectric constant of 3.7 and a dielectric loss of 0.006 at 50 Hz, making it desirable for the application in microelectronic devices.https://www.mdpi.com/2079-4991/12/3/4463D boron nitride skeletonsize effectepoxy compositesthrough-plane thermal conductivity |
| spellingShingle | Zhengdong Wang Tong Zhang Jinkai Wang Ganqiu Yang Mengli Li Guanglei Wu The Investigation of the Effect of Filler Sizes in 3D-BN Skeletons on Thermal Conductivity of Epoxy-Based Composites Nanomaterials 3D boron nitride skeleton size effect epoxy composites through-plane thermal conductivity |
| title | The Investigation of the Effect of Filler Sizes in 3D-BN Skeletons on Thermal Conductivity of Epoxy-Based Composites |
| title_full | The Investigation of the Effect of Filler Sizes in 3D-BN Skeletons on Thermal Conductivity of Epoxy-Based Composites |
| title_fullStr | The Investigation of the Effect of Filler Sizes in 3D-BN Skeletons on Thermal Conductivity of Epoxy-Based Composites |
| title_full_unstemmed | The Investigation of the Effect of Filler Sizes in 3D-BN Skeletons on Thermal Conductivity of Epoxy-Based Composites |
| title_short | The Investigation of the Effect of Filler Sizes in 3D-BN Skeletons on Thermal Conductivity of Epoxy-Based Composites |
| title_sort | investigation of the effect of filler sizes in 3d bn skeletons on thermal conductivity of epoxy based composites |
| topic | 3D boron nitride skeleton size effect epoxy composites through-plane thermal conductivity |
| url | https://www.mdpi.com/2079-4991/12/3/446 |
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