The Investigation of the Effect of Filler Sizes in 3D-BN Skeletons on Thermal Conductivity of Epoxy-Based Composites

Thermally conductive and electrically insulating materials have attracted much attention due to their applications in the field of microelectronics, but through-plane thermal conductivity of materials is still low at present. In this paper, a simple and environmentally friendly strategy is proposed...

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Bibliographic Details
Main Authors: Zhengdong Wang, Tong Zhang, Jinkai Wang, Ganqiu Yang, Mengli Li, Guanglei Wu
Format: Article
Language:English
Published: MDPI AG 2022-01-01
Series:Nanomaterials
Subjects:
Online Access:https://www.mdpi.com/2079-4991/12/3/446

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