The Investigation of the Effect of Filler Sizes in 3D-BN Skeletons on Thermal Conductivity of Epoxy-Based Composites
Thermally conductive and electrically insulating materials have attracted much attention due to their applications in the field of microelectronics, but through-plane thermal conductivity of materials is still low at present. In this paper, a simple and environmentally friendly strategy is proposed...
Main Authors: | Zhengdong Wang, Tong Zhang, Jinkai Wang, Ganqiu Yang, Mengli Li, Guanglei Wu |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2022-01-01
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Series: | Nanomaterials |
Subjects: | |
Online Access: | https://www.mdpi.com/2079-4991/12/3/446 |
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