1-Mbit 3-D DRAM Using a Monolithically Stacked Structure of a Si CMOS and Heterogeneous IGZO FETs

1-Mbit 3-D DRAM Using a Monolithically Stacked Structure of a Si CMOS and Heterogeneous IGZO FETs

We present a three-dimensional (3D) DRAM prototype, which is formed using oxide semiconductor FETs (OSFETs) monolithically stacked on a Si CMOS. The OSFETs are composed of a one-layer planar FET and two-layer vertical FETs (VFETs). The 1T1C memory cells in the VFET layers and a primary sense amplifi...

Full description

Bibliographic Details
Main Authors: Takeya Hirose, Yuki Okamoto, Yusuke Komura, Toshiki Mizuguchi, Toshihiko Saito, Minato Ito, Kiyotaka Kimura, Hiroki Inoue, Tatsuya Onuki, Yoshinori Ando, Hiromi Sawai, Tsutomu Murakawa, Hitoshi Kunitake, Hajime Kimura, Takanori Matsuzaki, Makoto Ikeda, Shunpei Yamazaki
Format: Article
Language:English
Published: IEEE 2024-01-01
Series:IEEE Journal of the Electron Devices Society
Subjects:
Extremely low off-state current
heterogeneous OSFETs
monolithic stacking
oxide semiconductor (OS)
planar FET
vertical FET
Online Access:https://ieeexplore.ieee.org/document/10457845/

Similar Items

Similar Items