Thermal conduction and strength of diamond-copper composite sandwich obtained by SPS diffusion bonding with Ti interlayer
Complex diamond/Cu composites prepared using diffusion bonding by spark plasma sintering (SPS) can realize the full potential of such composites. However, a high thermal conductivity (TC) cannot be achieved due to the diffusion-bonded interface's low bond strength and acoustic mismatch. An inte...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
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Elsevier
2023-09-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423023141 |
| _version_ | 1797646597367005184 |
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| author | Daochun Hu Lei Wang Minghe Chen Shaohui Feng Ning Wang Ying Zhou |
| author_facet | Daochun Hu Lei Wang Minghe Chen Shaohui Feng Ning Wang Ying Zhou |
| author_sort | Daochun Hu |
| collection | DOAJ |
| description | Complex diamond/Cu composites prepared using diffusion bonding by spark plasma sintering (SPS) can realize the full potential of such composites. However, a high thermal conductivity (TC) cannot be achieved due to the diffusion-bonded interface's low bond strength and acoustic mismatch. An intermetallic compound Cu2Ti and a carbide TiC were generated on the diffusion-bonded interface after adding a titanium (Ti) interlayer. The intermetallic compound Cu2Ti and carbide TiC change the mechanical bonding into chemical bonding between diamond and Cu, significantly improving the interfacial bond strength as the diffusion-bonded interface's shear strength increased from 44.94 to 61.23 MPa. And the shear fracture changes from brittle to ductile approximately to that of the Cu matrix. In the meantime, the phonon-regulating effect of the carbide TiC enables interfacial TC in the diamond/TiC/Cu structure to be stronger than that in the diamond/Cu structure. The Ti interlayer can improve the bond strength of the SPS diffusion-bonded interface and acoustic matching of diamond/Cu composites as the TC increased from 347.73 W/(m·K) to 483.37 W/(m·K), which is 86.47% of the base metal. |
| first_indexed | 2024-03-11T15:04:54Z |
| format | Article |
| id | doaj.art-94e79bae944d40cda53ed0a5cf464395 |
| institution | Directory Open Access Journal |
| issn | 2238-7854 |
| language | English |
| last_indexed | 2024-03-11T15:04:54Z |
| publishDate | 2023-09-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj.art-94e79bae944d40cda53ed0a5cf4643952023-10-30T06:04:54ZengElsevierJournal of Materials Research and Technology2238-78542023-09-012688068812Thermal conduction and strength of diamond-copper composite sandwich obtained by SPS diffusion bonding with Ti interlayerDaochun Hu0Lei Wang1Minghe Chen2Shaohui Feng3Ning Wang4Ying Zhou5School of Mechanical Engineering, Nanjing Vocational University of Industry Technology, Nanjing 210023, ChinaSchool of Mechanical Engineering, Nanjing Vocational University of Industry Technology, Nanjing 210023, ChinaCollege of Mechanical & Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China; Corresponding author.College of Mechanical & Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, ChinaSchool of Mechanical Engineering, Nanjing Vocational University of Industry Technology, Nanjing 210023, ChinaCollege of Mechanical & Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, ChinaComplex diamond/Cu composites prepared using diffusion bonding by spark plasma sintering (SPS) can realize the full potential of such composites. However, a high thermal conductivity (TC) cannot be achieved due to the diffusion-bonded interface's low bond strength and acoustic mismatch. An intermetallic compound Cu2Ti and a carbide TiC were generated on the diffusion-bonded interface after adding a titanium (Ti) interlayer. The intermetallic compound Cu2Ti and carbide TiC change the mechanical bonding into chemical bonding between diamond and Cu, significantly improving the interfacial bond strength as the diffusion-bonded interface's shear strength increased from 44.94 to 61.23 MPa. And the shear fracture changes from brittle to ductile approximately to that of the Cu matrix. In the meantime, the phonon-regulating effect of the carbide TiC enables interfacial TC in the diamond/TiC/Cu structure to be stronger than that in the diamond/Cu structure. The Ti interlayer can improve the bond strength of the SPS diffusion-bonded interface and acoustic matching of diamond/Cu composites as the TC increased from 347.73 W/(m·K) to 483.37 W/(m·K), which is 86.47% of the base metal.http://www.sciencedirect.com/science/article/pii/S2238785423023141Diamond/Cu compositesSPS diffusion bondingTi interlayerThermal conductivity |
| spellingShingle | Daochun Hu Lei Wang Minghe Chen Shaohui Feng Ning Wang Ying Zhou Thermal conduction and strength of diamond-copper composite sandwich obtained by SPS diffusion bonding with Ti interlayer Journal of Materials Research and Technology Diamond/Cu composites SPS diffusion bonding Ti interlayer Thermal conductivity |
| title | Thermal conduction and strength of diamond-copper composite sandwich obtained by SPS diffusion bonding with Ti interlayer |
| title_full | Thermal conduction and strength of diamond-copper composite sandwich obtained by SPS diffusion bonding with Ti interlayer |
| title_fullStr | Thermal conduction and strength of diamond-copper composite sandwich obtained by SPS diffusion bonding with Ti interlayer |
| title_full_unstemmed | Thermal conduction and strength of diamond-copper composite sandwich obtained by SPS diffusion bonding with Ti interlayer |
| title_short | Thermal conduction and strength of diamond-copper composite sandwich obtained by SPS diffusion bonding with Ti interlayer |
| title_sort | thermal conduction and strength of diamond copper composite sandwich obtained by sps diffusion bonding with ti interlayer |
| topic | Diamond/Cu composites SPS diffusion bonding Ti interlayer Thermal conductivity |
| url | http://www.sciencedirect.com/science/article/pii/S2238785423023141 |
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