Thermal conduction and strength of diamond-copper composite sandwich obtained by SPS diffusion bonding with Ti interlayer
Complex diamond/Cu composites prepared using diffusion bonding by spark plasma sintering (SPS) can realize the full potential of such composites. However, a high thermal conductivity (TC) cannot be achieved due to the diffusion-bonded interface's low bond strength and acoustic mismatch. An inte...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-09-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423023141 |