Effect of remelting heat treatment on the microstructure and mechanical properties of SnBi solder under high-speed self-propagation reaction
Abstract The heat source based on the self-propagation reaction of Al/Ni thin foil has the characteristics of concentrated heat, fast temperature rise/fall rate and small heat-affected zone; it can complete the melting and solidification crystallization of solder within milliseconds to realize solde...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
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Nature Portfolio
2022-06-01
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| Series: | Scientific Reports |
| Online Access: | https://doi.org/10.1038/s41598-022-13776-z |
| _version_ | 1818253112131977216 |
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| author | Yang Wan Longzao Zhou Fengshun Wu |
| author_facet | Yang Wan Longzao Zhou Fengshun Wu |
| author_sort | Yang Wan |
| collection | DOAJ |
| description | Abstract The heat source based on the self-propagation reaction of Al/Ni thin foil has the characteristics of concentrated heat, fast temperature rise/fall rate and small heat-affected zone; it can complete the melting and solidification crystallization of solder within milliseconds to realize solder interconnection, which can solve the problems of damage to heat-sensitive materials and components caused by monolithic heating of package structure. However, due to the highly non-stationary interconnection process, the resulting microstructure morphology may affect the service performance of the interconnected joints. In view of this, to investigate the post-solder microstructure of solder based on the self-propagation reaction, this paper analyzes the effect of the initial microstructure on the post-solder microstructure by heating 300-μm-thick SnBi solder with a 40-μm Al/Ni thin foil. The results indicated that the short melting time could resulted in the incomplete melting of heterogeneous phases and the non-uniform distribution of elements during the melting process, which had a significant effect on the morphology and composition distribution of the solidified microstructure, as well as the hardness distribution of the melted zone. The above conclusions have the potential to improve the interconnection process based on the self-propagation reaction, which is critical for both theoretical guidance and engineering application. |
| first_indexed | 2024-12-12T16:34:53Z |
| format | Article |
| id | doaj.art-950dc71f08194bbbae177b320d6ac7ee |
| institution | Directory Open Access Journal |
| issn | 2045-2322 |
| language | English |
| last_indexed | 2024-12-12T16:34:53Z |
| publishDate | 2022-06-01 |
| publisher | Nature Portfolio |
| record_format | Article |
| series | Scientific Reports |
| spelling | doaj.art-950dc71f08194bbbae177b320d6ac7ee2022-12-22T00:18:41ZengNature PortfolioScientific Reports2045-23222022-06-0112111010.1038/s41598-022-13776-zEffect of remelting heat treatment on the microstructure and mechanical properties of SnBi solder under high-speed self-propagation reactionYang Wan0Longzao Zhou1Fengshun Wu2School of Materials Science and Engineering, Huazhong University of Science and TechnologySchool of Materials Science and Engineering, Huazhong University of Science and TechnologySchool of Materials Science and Engineering, Huazhong University of Science and TechnologyAbstract The heat source based on the self-propagation reaction of Al/Ni thin foil has the characteristics of concentrated heat, fast temperature rise/fall rate and small heat-affected zone; it can complete the melting and solidification crystallization of solder within milliseconds to realize solder interconnection, which can solve the problems of damage to heat-sensitive materials and components caused by monolithic heating of package structure. However, due to the highly non-stationary interconnection process, the resulting microstructure morphology may affect the service performance of the interconnected joints. In view of this, to investigate the post-solder microstructure of solder based on the self-propagation reaction, this paper analyzes the effect of the initial microstructure on the post-solder microstructure by heating 300-μm-thick SnBi solder with a 40-μm Al/Ni thin foil. The results indicated that the short melting time could resulted in the incomplete melting of heterogeneous phases and the non-uniform distribution of elements during the melting process, which had a significant effect on the morphology and composition distribution of the solidified microstructure, as well as the hardness distribution of the melted zone. The above conclusions have the potential to improve the interconnection process based on the self-propagation reaction, which is critical for both theoretical guidance and engineering application.https://doi.org/10.1038/s41598-022-13776-z |
| spellingShingle | Yang Wan Longzao Zhou Fengshun Wu Effect of remelting heat treatment on the microstructure and mechanical properties of SnBi solder under high-speed self-propagation reaction Scientific Reports |
| title | Effect of remelting heat treatment on the microstructure and mechanical properties of SnBi solder under high-speed self-propagation reaction |
| title_full | Effect of remelting heat treatment on the microstructure and mechanical properties of SnBi solder under high-speed self-propagation reaction |
| title_fullStr | Effect of remelting heat treatment on the microstructure and mechanical properties of SnBi solder under high-speed self-propagation reaction |
| title_full_unstemmed | Effect of remelting heat treatment on the microstructure and mechanical properties of SnBi solder under high-speed self-propagation reaction |
| title_short | Effect of remelting heat treatment on the microstructure and mechanical properties of SnBi solder under high-speed self-propagation reaction |
| title_sort | effect of remelting heat treatment on the microstructure and mechanical properties of snbi solder under high speed self propagation reaction |
| url | https://doi.org/10.1038/s41598-022-13776-z |
| work_keys_str_mv | AT yangwan effectofremeltingheattreatmentonthemicrostructureandmechanicalpropertiesofsnbisolderunderhighspeedselfpropagationreaction AT longzaozhou effectofremeltingheattreatmentonthemicrostructureandmechanicalpropertiesofsnbisolderunderhighspeedselfpropagationreaction AT fengshunwu effectofremeltingheattreatmentonthemicrostructureandmechanicalpropertiesofsnbisolderunderhighspeedselfpropagationreaction |