Technological route and characteristics of home - built Ag, Ag/Cu, and Ag/Ni ohmic conductor pastes
The current research reports the preparation and fabrication of the silver paste conductor which is employed as a soldering material for electro – optical components ohmic interconnections. The prepared paste possesses electrical characteristics identical to the ohmic connectors as its observable f...
Main Author: | Mohammed K. Khalaf |
---|---|
Format: | Article |
Language: | English |
Published: |
University of Baghdad
2011-12-01
|
Series: | Iraqi Journal of Physics |
Subjects: | |
Online Access: | https://ijp.uobaghdad.edu.iq/index.php/physics/article/view/781 |
Similar Items
-
Effect of SiO2 nanoparticle addition on growth of interfacial Ag3Sn intermetallic compound layers between lead-free solder and silver conductor
by: Hsing-I Hsiang, et al.
Published: (2021-11-01) -
Vacuum Ohmic Heating: A Promising Technology for the Improvement of Tomato Paste Processing, Safety, Quality and Storage Stability
by: Asaad R. Al-Hilphy, et al.
Published: (2023-06-01) -
Vacuum Ohmic Heating: A Promising Technology for the Improvement of Tomato Paste Processing, Safety, Quality and Storage Stability
by: Asaad R. Al-Hilphy, et al.
Published: (2023-06-01) -
Vacuum Ohmic Heating: A Promising Technology for the Improvement of Tomato Paste Processing, Safety, Quality and Storage Stability
by: Asaad R. Al-Hilphy, et al.
Published: (2023-06-01) -
Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish /
by: Koid, Chun Ping, 1987-, et al.
Published: (2011)