Numerical Study of Double-Layered Microchannel Heat Sinks with Different Cross-Sectional Shapes

This work numerically studies the thermal and hydraulic performance of double-layered microchannel heat sinks (DL-MCHS) for their application in the cooling of high heat flux microelectronic devices. The superiority of double-layered microchannel heat sinks was assessed by a comparison with a single...

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Main Authors: Daxiang Deng, Guang Pi, Weixun Zhang, Peng Wang, Ting Fu
Format: Article
Language:English
Published: MDPI AG 2018-12-01
Series:Entropy
Subjects:
Online Access:http://www.mdpi.com/1099-4300/21/1/16
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author Daxiang Deng
Guang Pi
Weixun Zhang
Peng Wang
Ting Fu
author_facet Daxiang Deng
Guang Pi
Weixun Zhang
Peng Wang
Ting Fu
author_sort Daxiang Deng
collection DOAJ
description This work numerically studies the thermal and hydraulic performance of double-layered microchannel heat sinks (DL-MCHS) for their application in the cooling of high heat flux microelectronic devices. The superiority of double-layered microchannel heat sinks was assessed by a comparison with a single-layered microchannel heat sink (SL-MCHS) with the same triangular microchannels. Five DL-MCHSs with different cross-sectional shapes—triangular, rectangular, trapezoidal, circular and reentrant Ω-shaped—were explored and compared. The results showed that DL-MCHS decreased wall temperatures and thermal resistance considerably, induced much more uniform wall temperature distribution, and reduced the pressure drop and pumping power in comparison with SL-MCHS. The DL-MCHS with trapezoidal microchannels performed the worst with regard to thermal resistance, pressure drop, and pumping power. The DL-MCHS with rectangular microchannels produced the best overall thermal performance and seemed to be the optimum when thermal performance was the prime concern. Nevertheless, the DL-MCHS with reentrant Ω-shaped microchannels should be selected when pumping power consumption was the most important consideration.
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spelling doaj.art-95c4f0a3ca164e1a80192147a04cf6f72022-12-22T02:55:15ZengMDPI AGEntropy1099-43002018-12-012111610.3390/e21010016e21010016Numerical Study of Double-Layered Microchannel Heat Sinks with Different Cross-Sectional ShapesDaxiang Deng0Guang Pi1Weixun Zhang2Peng Wang3Ting Fu4Department of Mechanical & Electrical Engineering, Xiamen University, Xiamen 361005, ChinaDepartment of Mechanical & Electrical Engineering, Xiamen University, Xiamen 361005, ChinaDepartment of Mechanical & Electrical Engineering, Xiamen University, Xiamen 361005, ChinaTianjin Key Laboratory for Civil Aircraft Airworthiness and Maintenance Airworthiness and Maintenance, Civil Aviation University of China, Tianjin 300300, ChinaHubei Key Laboratory of Mechanical Transmission and Manufacturing Engineering in Wuhan University of Science and Technology, Wuhan 430000, ChinaThis work numerically studies the thermal and hydraulic performance of double-layered microchannel heat sinks (DL-MCHS) for their application in the cooling of high heat flux microelectronic devices. The superiority of double-layered microchannel heat sinks was assessed by a comparison with a single-layered microchannel heat sink (SL-MCHS) with the same triangular microchannels. Five DL-MCHSs with different cross-sectional shapes—triangular, rectangular, trapezoidal, circular and reentrant Ω-shaped—were explored and compared. The results showed that DL-MCHS decreased wall temperatures and thermal resistance considerably, induced much more uniform wall temperature distribution, and reduced the pressure drop and pumping power in comparison with SL-MCHS. The DL-MCHS with trapezoidal microchannels performed the worst with regard to thermal resistance, pressure drop, and pumping power. The DL-MCHS with rectangular microchannels produced the best overall thermal performance and seemed to be the optimum when thermal performance was the prime concern. Nevertheless, the DL-MCHS with reentrant Ω-shaped microchannels should be selected when pumping power consumption was the most important consideration.http://www.mdpi.com/1099-4300/21/1/16double-layered microchannel heat sinksmicrochannel shapenumerical simulationthermal resistance
spellingShingle Daxiang Deng
Guang Pi
Weixun Zhang
Peng Wang
Ting Fu
Numerical Study of Double-Layered Microchannel Heat Sinks with Different Cross-Sectional Shapes
Entropy
double-layered microchannel heat sinks
microchannel shape
numerical simulation
thermal resistance
title Numerical Study of Double-Layered Microchannel Heat Sinks with Different Cross-Sectional Shapes
title_full Numerical Study of Double-Layered Microchannel Heat Sinks with Different Cross-Sectional Shapes
title_fullStr Numerical Study of Double-Layered Microchannel Heat Sinks with Different Cross-Sectional Shapes
title_full_unstemmed Numerical Study of Double-Layered Microchannel Heat Sinks with Different Cross-Sectional Shapes
title_short Numerical Study of Double-Layered Microchannel Heat Sinks with Different Cross-Sectional Shapes
title_sort numerical study of double layered microchannel heat sinks with different cross sectional shapes
topic double-layered microchannel heat sinks
microchannel shape
numerical simulation
thermal resistance
url http://www.mdpi.com/1099-4300/21/1/16
work_keys_str_mv AT daxiangdeng numericalstudyofdoublelayeredmicrochannelheatsinkswithdifferentcrosssectionalshapes
AT guangpi numericalstudyofdoublelayeredmicrochannelheatsinkswithdifferentcrosssectionalshapes
AT weixunzhang numericalstudyofdoublelayeredmicrochannelheatsinkswithdifferentcrosssectionalshapes
AT pengwang numericalstudyofdoublelayeredmicrochannelheatsinkswithdifferentcrosssectionalshapes
AT tingfu numericalstudyofdoublelayeredmicrochannelheatsinkswithdifferentcrosssectionalshapes