Optimization of Cu/Sn Alloy Sputtering Process Based on Orthogonal Experimental Design Method
The performance of supercapacitors is directly influenced by the conductivity of polypyrrole, which serves as the electrode material. In order to balance considerations of cost-effectiveness and conductivity, this study employs magnetron sputtering to fabricate a copper–tin alloy layer as the conduc...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2023-07-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/14/8/1539 |
| _version_ | 1828715277221625856 |
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| author | Shuangjie Liu Xingwang Li Yongping Hao Xing Li Fengli Liu |
| author_facet | Shuangjie Liu Xingwang Li Yongping Hao Xing Li Fengli Liu |
| author_sort | Shuangjie Liu |
| collection | DOAJ |
| description | The performance of supercapacitors is directly influenced by the conductivity of polypyrrole, which serves as the electrode material. In order to balance considerations of cost-effectiveness and conductivity, this study employs magnetron sputtering to fabricate a copper–tin alloy layer as the conductive layer for polypyrrole. The deposition of a copper–tin alloy film through magnetron sputtering has a significant impact on the polymerization effect of pyrrole as well as being a crucial factor influencing the performance of supercapacitors. Various parameters, including working pressure, sputtering time, and sputtering power, affect the conductivity of the copper–tin alloy film. Furthermore, the degree of influence of each parameter on the conductivity of the copper–tin alloy film varies. This study utilizes an orthogonal experimental design to investigate the impact of various factors and levels on the conductivity and uniformity of a metal film. The objective is to optimize the process parameters for the creation of a copper–tin alloy film with desirable characteristics. Experimental results indicate that the working voltage, sputtering time, and sputtering power significantly influence the coefficient of variation, deposition rate, target current, and operating voltage of the film. Furthermore, FT-IR, XRD, and SEM tests are conducted on samples prepared using the identified optimal process parameters. In addition, we demonstrate various approaches to enhance the experiment’s reliability. The findings indicate that the most favorable process parameters for achieving optimal results are a working pressure of 0.065 Pa, a sputtering time of 20 min, and a sputtering power of 70 W. It was observed that the sputtering time significantly influences the uniformity of the copper–tin alloy film, whereas the sputtering power has a minimal impact on its uniformity. The deposition rate is primarily influenced by the working pressure, with the greatest effect observed. Conversely, the sputtering time has the least impact on the deposition rate. Similarly, the target current is predominantly affected by the sputtering power, exhibiting the greatest influence, while the sputtering time has the least effect. Furthermore, the working voltage is most significantly influenced by the working pressure, whereas the sputtering time has the least impact on the working voltage. |
| first_indexed | 2024-03-10T23:43:48Z |
| format | Article |
| id | doaj.art-95dd55d812ad467ab80f67368fc6cbeb |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-10T23:43:48Z |
| publishDate | 2023-07-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-95dd55d812ad467ab80f67368fc6cbeb2023-11-19T02:13:10ZengMDPI AGMicromachines2072-666X2023-07-01148153910.3390/mi14081539Optimization of Cu/Sn Alloy Sputtering Process Based on Orthogonal Experimental Design MethodShuangjie Liu0Xingwang Li1Yongping Hao2Xing Li3Fengli Liu4School of Equipment Engineering, Shenyang Ligong University, Shenyang 110159, ChinaSchool of Equipment Engineering, Shenyang Ligong University, Shenyang 110159, ChinaSchool of Equipment Engineering, Shenyang Ligong University, Shenyang 110159, ChinaSchool of Equipment Engineering, Shenyang Ligong University, Shenyang 110159, ChinaSchool of Mechanical Engineering, Shenyang Ligong University, Shenyang 110159, ChinaThe performance of supercapacitors is directly influenced by the conductivity of polypyrrole, which serves as the electrode material. In order to balance considerations of cost-effectiveness and conductivity, this study employs magnetron sputtering to fabricate a copper–tin alloy layer as the conductive layer for polypyrrole. The deposition of a copper–tin alloy film through magnetron sputtering has a significant impact on the polymerization effect of pyrrole as well as being a crucial factor influencing the performance of supercapacitors. Various parameters, including working pressure, sputtering time, and sputtering power, affect the conductivity of the copper–tin alloy film. Furthermore, the degree of influence of each parameter on the conductivity of the copper–tin alloy film varies. This study utilizes an orthogonal experimental design to investigate the impact of various factors and levels on the conductivity and uniformity of a metal film. The objective is to optimize the process parameters for the creation of a copper–tin alloy film with desirable characteristics. Experimental results indicate that the working voltage, sputtering time, and sputtering power significantly influence the coefficient of variation, deposition rate, target current, and operating voltage of the film. Furthermore, FT-IR, XRD, and SEM tests are conducted on samples prepared using the identified optimal process parameters. In addition, we demonstrate various approaches to enhance the experiment’s reliability. The findings indicate that the most favorable process parameters for achieving optimal results are a working pressure of 0.065 Pa, a sputtering time of 20 min, and a sputtering power of 70 W. It was observed that the sputtering time significantly influences the uniformity of the copper–tin alloy film, whereas the sputtering power has a minimal impact on its uniformity. The deposition rate is primarily influenced by the working pressure, with the greatest effect observed. Conversely, the sputtering time has the least impact on the deposition rate. Similarly, the target current is predominantly affected by the sputtering power, exhibiting the greatest influence, while the sputtering time has the least effect. Furthermore, the working voltage is most significantly influenced by the working pressure, whereas the sputtering time has the least impact on the working voltage.https://www.mdpi.com/2072-666X/14/8/1539magnetron sputteringcopper–tin alloy filmelectrical conductivityorthogonal experimental designuniformity |
| spellingShingle | Shuangjie Liu Xingwang Li Yongping Hao Xing Li Fengli Liu Optimization of Cu/Sn Alloy Sputtering Process Based on Orthogonal Experimental Design Method Micromachines magnetron sputtering copper–tin alloy film electrical conductivity orthogonal experimental design uniformity |
| title | Optimization of Cu/Sn Alloy Sputtering Process Based on Orthogonal Experimental Design Method |
| title_full | Optimization of Cu/Sn Alloy Sputtering Process Based on Orthogonal Experimental Design Method |
| title_fullStr | Optimization of Cu/Sn Alloy Sputtering Process Based on Orthogonal Experimental Design Method |
| title_full_unstemmed | Optimization of Cu/Sn Alloy Sputtering Process Based on Orthogonal Experimental Design Method |
| title_short | Optimization of Cu/Sn Alloy Sputtering Process Based on Orthogonal Experimental Design Method |
| title_sort | optimization of cu sn alloy sputtering process based on orthogonal experimental design method |
| topic | magnetron sputtering copper–tin alloy film electrical conductivity orthogonal experimental design uniformity |
| url | https://www.mdpi.com/2072-666X/14/8/1539 |
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