Ultrasonic resonance-based inspection of ultra-thin nickel sheets bonded to silicone
In the field of non-destructive testing (NDT), The detection of bonding defects between ultra-thin metal and silica gel is a difficult problem. In this study, In this study, ultrasonic resonance method was used to evaluate the bonding strength of ultra-thin metal to silica gel bonding structure. The...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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IOP Publishing
2023-01-01
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| Series: | Materials Research Express |
| Subjects: | |
| Online Access: | https://doi.org/10.1088/2053-1591/acc00e |
| _version_ | 1797746484614004736 |
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| author | Huaishu Hou Jinhao Li Shuaijun Xia Yujie Meng Jicai Shen |
| author_facet | Huaishu Hou Jinhao Li Shuaijun Xia Yujie Meng Jicai Shen |
| author_sort | Huaishu Hou |
| collection | DOAJ |
| description | In the field of non-destructive testing (NDT), The detection of bonding defects between ultra-thin metal and silica gel is a difficult problem. In this study, In this study, ultrasonic resonance method was used to evaluate the bonding strength of ultra-thin metal to silica gel bonding structure. The composite parts of ultra-thin nickel sheet and silicon sheet with three different bonding states were studied. The bonding state of nickel sheet and silica gel is different, and the absorption of ultrasound is different. Using the resonance generated by high-frequency ultrasound in ultra-thin nickel sheet, the acoustic attenuation of the combination of ultra-thin nickel sheet and silicon rubber sheet was analyzed by resonance signal, and the bonding state between ultra-thin nickel sheet and silicon rubber sheet was characterized by bonding coefficient. Through experimental comparison, the results showed that the attenuation of ultrasonic signal in the nickel sheet and silicon film with different adhesive states characterize the adhesive state of ultra-thin nickel sheet and silicon film by the bonding coefficient, the bonding coefficient of good parts, weak adhesive parts and debonded parts is reduced successively. By setting an appropriate determination threshold value, the bonding state between the ultra-thin nickel sheet and the silicon film can be accurately determined according to the bonding coefficient obtained by detection. |
| first_indexed | 2024-03-12T15:38:25Z |
| format | Article |
| id | doaj.art-96b987df84534557895586fed9505d0b |
| institution | Directory Open Access Journal |
| issn | 2053-1591 |
| language | English |
| last_indexed | 2024-03-12T15:38:25Z |
| publishDate | 2023-01-01 |
| publisher | IOP Publishing |
| record_format | Article |
| series | Materials Research Express |
| spelling | doaj.art-96b987df84534557895586fed9505d0b2023-08-09T16:07:39ZengIOP PublishingMaterials Research Express2053-15912023-01-0110404650210.1088/2053-1591/acc00eUltrasonic resonance-based inspection of ultra-thin nickel sheets bonded to siliconeHuaishu Hou0Jinhao Li1https://orcid.org/0009-0009-3592-0855Shuaijun Xia2Yujie Meng3Jicai Shen4School of Mechanical Engineering, Shanghai Institute of Technology , Shanghai 201418, People’s Republic of ChinaSchool of Mechanical Engineering, Shanghai Institute of Technology , Shanghai 201418, People’s Republic of ChinaSchool of Mechanical Engineering, Shanghai Institute of Technology , Shanghai 201418, People’s Republic of ChinaSchool of Mechanical Engineering, Shanghai Institute of Technology , Shanghai 201418, People’s Republic of ChinaSchool of Mechanical Engineering, Shanghai Institute of Technology , Shanghai 201418, People’s Republic of ChinaIn the field of non-destructive testing (NDT), The detection of bonding defects between ultra-thin metal and silica gel is a difficult problem. In this study, In this study, ultrasonic resonance method was used to evaluate the bonding strength of ultra-thin metal to silica gel bonding structure. The composite parts of ultra-thin nickel sheet and silicon sheet with three different bonding states were studied. The bonding state of nickel sheet and silica gel is different, and the absorption of ultrasound is different. Using the resonance generated by high-frequency ultrasound in ultra-thin nickel sheet, the acoustic attenuation of the combination of ultra-thin nickel sheet and silicon rubber sheet was analyzed by resonance signal, and the bonding state between ultra-thin nickel sheet and silicon rubber sheet was characterized by bonding coefficient. Through experimental comparison, the results showed that the attenuation of ultrasonic signal in the nickel sheet and silicon film with different adhesive states characterize the adhesive state of ultra-thin nickel sheet and silicon film by the bonding coefficient, the bonding coefficient of good parts, weak adhesive parts and debonded parts is reduced successively. By setting an appropriate determination threshold value, the bonding state between the ultra-thin nickel sheet and the silicon film can be accurately determined according to the bonding coefficient obtained by detection.https://doi.org/10.1088/2053-1591/acc00enickel sheetsilicone filmultrasonic resonancebonding factornon-destructive testing |
| spellingShingle | Huaishu Hou Jinhao Li Shuaijun Xia Yujie Meng Jicai Shen Ultrasonic resonance-based inspection of ultra-thin nickel sheets bonded to silicone Materials Research Express nickel sheet silicone film ultrasonic resonance bonding factor non-destructive testing |
| title | Ultrasonic resonance-based inspection of ultra-thin nickel sheets bonded to silicone |
| title_full | Ultrasonic resonance-based inspection of ultra-thin nickel sheets bonded to silicone |
| title_fullStr | Ultrasonic resonance-based inspection of ultra-thin nickel sheets bonded to silicone |
| title_full_unstemmed | Ultrasonic resonance-based inspection of ultra-thin nickel sheets bonded to silicone |
| title_short | Ultrasonic resonance-based inspection of ultra-thin nickel sheets bonded to silicone |
| title_sort | ultrasonic resonance based inspection of ultra thin nickel sheets bonded to silicone |
| topic | nickel sheet silicone film ultrasonic resonance bonding factor non-destructive testing |
| url | https://doi.org/10.1088/2053-1591/acc00e |
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