Structural materialization of stainless steel molds and dies by the low temperature high density plasma nitriding
Various kinds of stainless steels have been widely utilized as a mold substrate material for injection molding and as a die for mold-stamping and direct stamping processes. Since they suffered from high temperature transients and thermal cycles in practice, they must be surface-treated by dry and we...
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| Format: | Article |
| Language: | English |
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EDP Sciences
2015-01-01
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| Series: | MATEC Web of Conferences |
| Online Access: | http://dx.doi.org/10.1051/matecconf/20152108002 |
| _version_ | 1818911976984674304 |
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| author | Aizawa Tatsuhiko Fukuda Tatsuya Morita Hiroshi |
| author_facet | Aizawa Tatsuhiko Fukuda Tatsuya Morita Hiroshi |
| author_sort | Aizawa Tatsuhiko |
| collection | DOAJ |
| description | Various kinds of stainless steels have been widely utilized as a mold substrate material for injection molding and as a die for mold-stamping and direct stamping processes. Since they suffered from high temperature transients and thermal cycles in practice, they must be surface-treated by dry and wet coatings, or, by plasma nitriding. Martensitic stainless steel mold was first wet plated by the nickel phosphate (NiP), which was unstable at the high temperature stamping condition; and, was easy to crystalize or to fracture by itself. This issue of nuisance significantly lowered the productivity in fabrication of optical elements at present. In the present paper, the stainless steel mold was surface-treated by the low-temperature plasma nitriding. The nitrided layer by this surface modification had higher nitrogen solute content than 4 mass%; the maximum solid-solubility of nitrogen is usually 0.1 mass% in the equilibrium phase diagram. Owing to this solid-solution with high nitrogen concentration, the nitrided layer had high hardness of 1400 Hv within its thickness of 40 μm without any formation of nitrides after 14.4 ks plasma nitriding at 693 K. This nitrogen solid-solution treated stainless steel had thermal resistivity even at the mold-stamping conditions up to 900 K. |
| first_indexed | 2024-12-19T23:07:16Z |
| format | Article |
| id | doaj.art-96bea272afe640ce9a6bc79c5658f743 |
| institution | Directory Open Access Journal |
| issn | 2261-236X |
| language | English |
| last_indexed | 2024-12-19T23:07:16Z |
| publishDate | 2015-01-01 |
| publisher | EDP Sciences |
| record_format | Article |
| series | MATEC Web of Conferences |
| spelling | doaj.art-96bea272afe640ce9a6bc79c5658f7432022-12-21T20:02:20ZengEDP SciencesMATEC Web of Conferences2261-236X2015-01-01210800210.1051/matecconf/20152108002matecconf-icnft2015_08002Structural materialization of stainless steel molds and dies by the low temperature high density plasma nitridingAizawa Tatsuhiko0Fukuda Tatsuya1Morita Hiroshi2Department of Engineering and Design, Shibaura Institute of TechnologyResearch Center, Kimura Precision, Co. Ltd.Nano-Coat LaboratoryVarious kinds of stainless steels have been widely utilized as a mold substrate material for injection molding and as a die for mold-stamping and direct stamping processes. Since they suffered from high temperature transients and thermal cycles in practice, they must be surface-treated by dry and wet coatings, or, by plasma nitriding. Martensitic stainless steel mold was first wet plated by the nickel phosphate (NiP), which was unstable at the high temperature stamping condition; and, was easy to crystalize or to fracture by itself. This issue of nuisance significantly lowered the productivity in fabrication of optical elements at present. In the present paper, the stainless steel mold was surface-treated by the low-temperature plasma nitriding. The nitrided layer by this surface modification had higher nitrogen solute content than 4 mass%; the maximum solid-solubility of nitrogen is usually 0.1 mass% in the equilibrium phase diagram. Owing to this solid-solution with high nitrogen concentration, the nitrided layer had high hardness of 1400 Hv within its thickness of 40 μm without any formation of nitrides after 14.4 ks plasma nitriding at 693 K. This nitrogen solid-solution treated stainless steel had thermal resistivity even at the mold-stamping conditions up to 900 K.http://dx.doi.org/10.1051/matecconf/20152108002 |
| spellingShingle | Aizawa Tatsuhiko Fukuda Tatsuya Morita Hiroshi Structural materialization of stainless steel molds and dies by the low temperature high density plasma nitriding MATEC Web of Conferences |
| title | Structural materialization of stainless steel molds and dies by the low temperature high density plasma nitriding |
| title_full | Structural materialization of stainless steel molds and dies by the low temperature high density plasma nitriding |
| title_fullStr | Structural materialization of stainless steel molds and dies by the low temperature high density plasma nitriding |
| title_full_unstemmed | Structural materialization of stainless steel molds and dies by the low temperature high density plasma nitriding |
| title_short | Structural materialization of stainless steel molds and dies by the low temperature high density plasma nitriding |
| title_sort | structural materialization of stainless steel molds and dies by the low temperature high density plasma nitriding |
| url | http://dx.doi.org/10.1051/matecconf/20152108002 |
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