AlGaInAs Multi-Quantum Well Lasers on Silicon-on-Insulator Photonic Integrated Circuits Based on InP-Seed-Bonding and Epitaxial Regrowth

The tremendous demand for low-cost, low-consumption and high-capacity optical transmitters in data centers challenges the current InP-photonics platform. The use of silicon (Si) photonics platform to fabricate photonic integrated circuits (PICs) is a promising approach for low-cost large-scale fabri...

Full description

Bibliographic Details
Main Authors: Claire Besancon, Delphine Néel, Dalila Make, Joan Manel Ramírez, Giancarlo Cerulo, Nicolas Vaissiere, David Bitauld, Frédéric Pommereau, Frank Fournel, Cécilia Dupré, Hussein Mehdi, Franck Bassani, Jean Decobert
Format: Article
Language:English
Published: MDPI AG 2021-12-01
Series:Applied Sciences
Subjects:
Online Access:https://www.mdpi.com/2076-3417/12/1/263
_version_ 1797499582015340544
author Claire Besancon
Delphine Néel
Dalila Make
Joan Manel Ramírez
Giancarlo Cerulo
Nicolas Vaissiere
David Bitauld
Frédéric Pommereau
Frank Fournel
Cécilia Dupré
Hussein Mehdi
Franck Bassani
Jean Decobert
author_facet Claire Besancon
Delphine Néel
Dalila Make
Joan Manel Ramírez
Giancarlo Cerulo
Nicolas Vaissiere
David Bitauld
Frédéric Pommereau
Frank Fournel
Cécilia Dupré
Hussein Mehdi
Franck Bassani
Jean Decobert
author_sort Claire Besancon
collection DOAJ
description The tremendous demand for low-cost, low-consumption and high-capacity optical transmitters in data centers challenges the current InP-photonics platform. The use of silicon (Si) photonics platform to fabricate photonic integrated circuits (PICs) is a promising approach for low-cost large-scale fabrication considering the CMOS-technology maturity and scalability. However, Si itself cannot provide an efficient emitting light source due to its indirect bandgap. Therefore, the integration of III-V semiconductors on Si wafers allows us to benefit from the III-V emitting properties combined with benefits offered by the Si photonics platform. Direct epitaxy of InP-based materials on 300 mm Si wafers is the most promising approach to reduce the costs. However, the differences between InP and Si in terms of lattice mismatch, thermal coefficients and polarity inducing defects are challenging issues to overcome. III-V/Si hetero-integration platform by wafer-bonding is the most mature integration scheme. However, no additional epitaxial regrowth steps are implemented after the bonding step. Considering the much larger epitaxial toolkit available in the conventional monolithic InP platform, where several epitaxial steps are often implemented, this represents a significant limitation. In this paper, we review an advanced integration scheme of AlGaInAs-based laser sources on Si wafers by bonding a thin InP seed on which further regrowth steps are implemented. A 3 µm-thick AlGaInAs-based MutiQuantum Wells (MQW) laser structure was grown onto on InP-SiO<sub>2</sub>/Si (InPoSi) wafer and compared to the same structure grown on InP wafer as a reference. The 400 ppm thermal strain on the structure grown on InPoSi, induced by the difference of coefficient of thermal expansion between InP and Si, was assessed at growth temperature. We also showed that this structure demonstrates laser performance similar to the ones obtained for the same structure grown on InP. Therefore, no material degradation was observed in spite of the thermal strain. Then, we developed the Selective Area Growth (SAG) technique to grow multi-wavelength laser sources from a single growth step on InPoSi. A 155 nm-wide spectral range from 1515 nm to 1670 nm was achieved. Furthermore, an AlGaInAs MQW-based laser source was successfully grown on InP-SOI wafers and efficiently coupled to Si-photonic DBR cavities. Altogether, the regrowth on InP-SOI wafers holds great promises to combine the best from the III-V monolithic platform combined with the possibilities offered by the Si photonics circuitry via efficient light-coupling.
first_indexed 2024-03-10T03:50:27Z
format Article
id doaj.art-9735c93320c343ec8baffdde11dd8ebc
institution Directory Open Access Journal
issn 2076-3417
language English
last_indexed 2024-03-10T03:50:27Z
publishDate 2021-12-01
publisher MDPI AG
record_format Article
series Applied Sciences
spelling doaj.art-9735c93320c343ec8baffdde11dd8ebc2023-11-23T11:10:15ZengMDPI AGApplied Sciences2076-34172021-12-0112126310.3390/app12010263AlGaInAs Multi-Quantum Well Lasers on Silicon-on-Insulator Photonic Integrated Circuits Based on InP-Seed-Bonding and Epitaxial RegrowthClaire Besancon0Delphine Néel1Dalila Make2Joan Manel Ramírez3Giancarlo Cerulo4Nicolas Vaissiere5David Bitauld6Frédéric Pommereau7Frank Fournel8Cécilia Dupré9Hussein Mehdi10Franck Bassani11Jean Decobert12III-V Lab, A Joint Lab of Nokia Bell Labs, Thales Research and Technology and CEA LETI, 91120 Palaiseau, FranceIII-V Lab, A Joint Lab of Nokia Bell Labs, Thales Research and Technology and CEA LETI, 91120 Palaiseau, FranceIII-V Lab, A Joint Lab of Nokia Bell Labs, Thales Research and Technology and CEA LETI, 91120 Palaiseau, FranceIII-V Lab, A Joint Lab of Nokia Bell Labs, Thales Research and Technology and CEA LETI, 91120 Palaiseau, FranceIII-V Lab, A Joint Lab of Nokia Bell Labs, Thales Research and Technology and CEA LETI, 91120 Palaiseau, FranceIII-V Lab, A Joint Lab of Nokia Bell Labs, Thales Research and Technology and CEA LETI, 91120 Palaiseau, FranceIII-V Lab, A Joint Lab of Nokia Bell Labs, Thales Research and Technology and CEA LETI, 91120 Palaiseau, FranceIII-V Lab, A Joint Lab of Nokia Bell Labs, Thales Research and Technology and CEA LETI, 91120 Palaiseau, FranceLETI, University Grenoble Alpes, CEA, 38054 Grenoble, FranceLETI, University Grenoble Alpes, CEA, 38054 Grenoble, FranceLETI, CNRS, University Grenoble Alpes, CEA, LTM, 38054 Grenoble, FranceLETI, CNRS, University Grenoble Alpes, CEA, LTM, 38054 Grenoble, FranceIII-V Lab, A Joint Lab of Nokia Bell Labs, Thales Research and Technology and CEA LETI, 91120 Palaiseau, FranceThe tremendous demand for low-cost, low-consumption and high-capacity optical transmitters in data centers challenges the current InP-photonics platform. The use of silicon (Si) photonics platform to fabricate photonic integrated circuits (PICs) is a promising approach for low-cost large-scale fabrication considering the CMOS-technology maturity and scalability. However, Si itself cannot provide an efficient emitting light source due to its indirect bandgap. Therefore, the integration of III-V semiconductors on Si wafers allows us to benefit from the III-V emitting properties combined with benefits offered by the Si photonics platform. Direct epitaxy of InP-based materials on 300 mm Si wafers is the most promising approach to reduce the costs. However, the differences between InP and Si in terms of lattice mismatch, thermal coefficients and polarity inducing defects are challenging issues to overcome. III-V/Si hetero-integration platform by wafer-bonding is the most mature integration scheme. However, no additional epitaxial regrowth steps are implemented after the bonding step. Considering the much larger epitaxial toolkit available in the conventional monolithic InP platform, where several epitaxial steps are often implemented, this represents a significant limitation. In this paper, we review an advanced integration scheme of AlGaInAs-based laser sources on Si wafers by bonding a thin InP seed on which further regrowth steps are implemented. A 3 µm-thick AlGaInAs-based MutiQuantum Wells (MQW) laser structure was grown onto on InP-SiO<sub>2</sub>/Si (InPoSi) wafer and compared to the same structure grown on InP wafer as a reference. The 400 ppm thermal strain on the structure grown on InPoSi, induced by the difference of coefficient of thermal expansion between InP and Si, was assessed at growth temperature. We also showed that this structure demonstrates laser performance similar to the ones obtained for the same structure grown on InP. Therefore, no material degradation was observed in spite of the thermal strain. Then, we developed the Selective Area Growth (SAG) technique to grow multi-wavelength laser sources from a single growth step on InPoSi. A 155 nm-wide spectral range from 1515 nm to 1670 nm was achieved. Furthermore, an AlGaInAs MQW-based laser source was successfully grown on InP-SOI wafers and efficiently coupled to Si-photonic DBR cavities. Altogether, the regrowth on InP-SOI wafers holds great promises to combine the best from the III-V monolithic platform combined with the possibilities offered by the Si photonics circuitry via efficient light-coupling.https://www.mdpi.com/2076-3417/12/1/263heterogeneous integrationepitaxial growthdirect wafer bondingsemiconductor laserssilicon photonics
spellingShingle Claire Besancon
Delphine Néel
Dalila Make
Joan Manel Ramírez
Giancarlo Cerulo
Nicolas Vaissiere
David Bitauld
Frédéric Pommereau
Frank Fournel
Cécilia Dupré
Hussein Mehdi
Franck Bassani
Jean Decobert
AlGaInAs Multi-Quantum Well Lasers on Silicon-on-Insulator Photonic Integrated Circuits Based on InP-Seed-Bonding and Epitaxial Regrowth
Applied Sciences
heterogeneous integration
epitaxial growth
direct wafer bonding
semiconductor lasers
silicon photonics
title AlGaInAs Multi-Quantum Well Lasers on Silicon-on-Insulator Photonic Integrated Circuits Based on InP-Seed-Bonding and Epitaxial Regrowth
title_full AlGaInAs Multi-Quantum Well Lasers on Silicon-on-Insulator Photonic Integrated Circuits Based on InP-Seed-Bonding and Epitaxial Regrowth
title_fullStr AlGaInAs Multi-Quantum Well Lasers on Silicon-on-Insulator Photonic Integrated Circuits Based on InP-Seed-Bonding and Epitaxial Regrowth
title_full_unstemmed AlGaInAs Multi-Quantum Well Lasers on Silicon-on-Insulator Photonic Integrated Circuits Based on InP-Seed-Bonding and Epitaxial Regrowth
title_short AlGaInAs Multi-Quantum Well Lasers on Silicon-on-Insulator Photonic Integrated Circuits Based on InP-Seed-Bonding and Epitaxial Regrowth
title_sort algainas multi quantum well lasers on silicon on insulator photonic integrated circuits based on inp seed bonding and epitaxial regrowth
topic heterogeneous integration
epitaxial growth
direct wafer bonding
semiconductor lasers
silicon photonics
url https://www.mdpi.com/2076-3417/12/1/263
work_keys_str_mv AT clairebesancon algainasmultiquantumwelllasersonsilicononinsulatorphotonicintegratedcircuitsbasedoninpseedbondingandepitaxialregrowth
AT delphineneel algainasmultiquantumwelllasersonsilicononinsulatorphotonicintegratedcircuitsbasedoninpseedbondingandepitaxialregrowth
AT dalilamake algainasmultiquantumwelllasersonsilicononinsulatorphotonicintegratedcircuitsbasedoninpseedbondingandepitaxialregrowth
AT joanmanelramirez algainasmultiquantumwelllasersonsilicononinsulatorphotonicintegratedcircuitsbasedoninpseedbondingandepitaxialregrowth
AT giancarlocerulo algainasmultiquantumwelllasersonsilicononinsulatorphotonicintegratedcircuitsbasedoninpseedbondingandepitaxialregrowth
AT nicolasvaissiere algainasmultiquantumwelllasersonsilicononinsulatorphotonicintegratedcircuitsbasedoninpseedbondingandepitaxialregrowth
AT davidbitauld algainasmultiquantumwelllasersonsilicononinsulatorphotonicintegratedcircuitsbasedoninpseedbondingandepitaxialregrowth
AT fredericpommereau algainasmultiquantumwelllasersonsilicononinsulatorphotonicintegratedcircuitsbasedoninpseedbondingandepitaxialregrowth
AT frankfournel algainasmultiquantumwelllasersonsilicononinsulatorphotonicintegratedcircuitsbasedoninpseedbondingandepitaxialregrowth
AT ceciliadupre algainasmultiquantumwelllasersonsilicononinsulatorphotonicintegratedcircuitsbasedoninpseedbondingandepitaxialregrowth
AT husseinmehdi algainasmultiquantumwelllasersonsilicononinsulatorphotonicintegratedcircuitsbasedoninpseedbondingandepitaxialregrowth
AT franckbassani algainasmultiquantumwelllasersonsilicononinsulatorphotonicintegratedcircuitsbasedoninpseedbondingandepitaxialregrowth
AT jeandecobert algainasmultiquantumwelllasersonsilicononinsulatorphotonicintegratedcircuitsbasedoninpseedbondingandepitaxialregrowth