Fabrication Process and Performance Analysis of CSP LED Filaments with a Stacked Package Design
This article presents a chip-scale package (CSP) based filament light-emitting diodes (LEDs) with a stacked-type structure and a segmented-type luminescence design for higher luminous efficiency and better electrical stability. The innovation strategy improves the luminous efficiency by 7.69% and 18...
| প্রধান লেখক: | , , , , , , , , , |
|---|---|
| বিন্যাস: | প্রবন্ধ |
| ভাষা: | English |
| প্রকাশিত: |
MDPI AG
2018-10-01
|
| মালা: | Applied Sciences |
| বিষয়গুলি: | |
| অনলাইন ব্যবহার করুন: | http://www.mdpi.com/2076-3417/8/10/1940 |