Fabrication Process and Performance Analysis of CSP LED Filaments with a Stacked Package Design

Fabrication Process and Performance Analysis of CSP LED Filaments with a Stacked Package Design

This article presents a chip-scale package (CSP) based filament light-emitting diodes (LEDs) with a stacked-type structure and a segmented-type luminescence design for higher luminous efficiency and better electrical stability. The innovation strategy improves the luminous efficiency by 7.69% and 18...

Disgrifiad llawn

Manylion Llyfryddiaeth
Prif Awduron: Nan Jiang, Jun Zou, Changran Zheng, Mingming Shi, Wenbo Li, Yiming Liu, Bin Guo, Jerry Liu, Herry Liu, Xavier Yin
Fformat: Erthygl
Iaith:English
Cyhoeddwyd: MDPI AG 2018-10-01
Cyfres:Applied Sciences
Pynciau:
optical design and fabrication
chip-scale package
light-emitting diode
optical devices
Mynediad Ar-lein:http://www.mdpi.com/2076-3417/8/10/1940

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http://www.mdpi.com/2076-3417/8/10/1940

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