Fabrication Process and Performance Analysis of CSP LED Filaments with a Stacked Package Design
This article presents a chip-scale package (CSP) based filament light-emitting diodes (LEDs) with a stacked-type structure and a segmented-type luminescence design for higher luminous efficiency and better electrical stability. The innovation strategy improves the luminous efficiency by 7.69% and 18...
| Main Authors: | , , , , , , , , , |
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| פורמט: | Article |
| שפה: | English |
| יצא לאור: |
MDPI AG
2018-10-01
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| סדרה: | Applied Sciences |
| נושאים: | |
| גישה מקוונת: | http://www.mdpi.com/2076-3417/8/10/1940 |