Dry Etching of Copper Phthalocyanine Thin Films: Effects on Morphology and Surface Stoichiometry

We investigate the evolution of copper phthalocyanine thin films as they are etched with argon plasma. Significant morphological changes occur as a result of the ion bombardment; a planar surface quickly becomes an array of nanopillars which are less than 20 nm in diameter. The changes in morphology...

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Main Authors: Michael J. Brett, Jaron G. Van Dijken
Format: Article
Language:English
Published: MDPI AG 2012-08-01
Series:Molecules
Subjects:
Online Access:http://www.mdpi.com/1420-3049/17/9/10119
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author Michael J. Brett
Jaron G. Van Dijken
author_facet Michael J. Brett
Jaron G. Van Dijken
author_sort Michael J. Brett
collection DOAJ
description We investigate the evolution of copper phthalocyanine thin films as they are etched with argon plasma. Significant morphological changes occur as a result of the ion bombardment; a planar surface quickly becomes an array of nanopillars which are less than 20 nm in diameter. The changes in morphology are independent of plasma power, which controls the etch rate only. Analysis by X-ray photoelectron spectroscopy shows that surface concentrations of copper and oxygen increase with etch time, while carbon and nitrogen are depleted. Despite these changes in surface stoichiometry, we observe no effect on the work function. The absorbance and X-ray diffraction spectra show no changes other than the peaks diminishing with etch time. These findings have important implications for organic photovoltaic devices which seek nanopillar thin films of metal phthalocyanine materials as an optimal structure.
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spelling doaj.art-990b4fd00cde4c9fb7bb5abd8c7eeb532022-12-21T23:22:53ZengMDPI AGMolecules1420-30492012-08-01179101191013010.3390/molecules170910119Dry Etching of Copper Phthalocyanine Thin Films: Effects on Morphology and Surface StoichiometryMichael J. BrettJaron G. Van DijkenWe investigate the evolution of copper phthalocyanine thin films as they are etched with argon plasma. Significant morphological changes occur as a result of the ion bombardment; a planar surface quickly becomes an array of nanopillars which are less than 20 nm in diameter. The changes in morphology are independent of plasma power, which controls the etch rate only. Analysis by X-ray photoelectron spectroscopy shows that surface concentrations of copper and oxygen increase with etch time, while carbon and nitrogen are depleted. Despite these changes in surface stoichiometry, we observe no effect on the work function. The absorbance and X-ray diffraction spectra show no changes other than the peaks diminishing with etch time. These findings have important implications for organic photovoltaic devices which seek nanopillar thin films of metal phthalocyanine materials as an optimal structure.http://www.mdpi.com/1420-3049/17/9/10119phthalocyanine dyesvapor phase processesdry etchingnanopillar formation
spellingShingle Michael J. Brett
Jaron G. Van Dijken
Dry Etching of Copper Phthalocyanine Thin Films: Effects on Morphology and Surface Stoichiometry
Molecules
phthalocyanine dyes
vapor phase processes
dry etching
nanopillar formation
title Dry Etching of Copper Phthalocyanine Thin Films: Effects on Morphology and Surface Stoichiometry
title_full Dry Etching of Copper Phthalocyanine Thin Films: Effects on Morphology and Surface Stoichiometry
title_fullStr Dry Etching of Copper Phthalocyanine Thin Films: Effects on Morphology and Surface Stoichiometry
title_full_unstemmed Dry Etching of Copper Phthalocyanine Thin Films: Effects on Morphology and Surface Stoichiometry
title_short Dry Etching of Copper Phthalocyanine Thin Films: Effects on Morphology and Surface Stoichiometry
title_sort dry etching of copper phthalocyanine thin films effects on morphology and surface stoichiometry
topic phthalocyanine dyes
vapor phase processes
dry etching
nanopillar formation
url http://www.mdpi.com/1420-3049/17/9/10119
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AT jarongvandijken dryetchingofcopperphthalocyaninethinfilmseffectsonmorphologyandsurfacestoichiometry