A Simple and Non-Destructive Method to Measure Per-Terminal Baseplate Coupling of Power Modules
The fast slew rates of wide bandgap semiconductors can produce common-mode currents that flow through the baseplates of multi-chip power modules. These currents increase the electromagnetic signature of these devices and force designers to reduce edge rates or add additional filters in order to meet...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2023-01-01
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| Series: | IEEE Open Journal of Power Electronics |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10323500/ |