Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using Simulation
The integration of assembled foils in injection-molded parts is a challenging step. Such assembled foils typically comprise a plastic foil on which a circuit board is printed and electronic components are mounted. Those components can detach during overmolding when high pressures and shear stresses...
| Main Authors: | , , , , , , , |
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| פורמט: | Article |
| שפה: | English |
| יצא לאור: |
MDPI AG
2023-04-01
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| סדרה: | Micromachines |
| נושאים: | |
| גישה מקוונת: | https://www.mdpi.com/2072-666X/14/4/876 |