Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using Simulation

Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using Simulation

The integration of assembled foils in injection-molded parts is a challenging step. Such assembled foils typically comprise a plastic foil on which a circuit board is printed and electronic components are mounted. Those components can detach during overmolding when high pressures and shear stresses...

Full description

Bibliographic Details
Main Authors: Martin Hubmann, Mona Bakr, Jonas Groten, Martin Pletz, Jan Vanfleteren, Frederick Bossuyt, Behnam Madadnia, Barbara Stadlober
Format: Article
Language:English
Published: MDPI AG 2023-04-01
Series:Micromachines
Subjects:
injection molding
simulation
in-mold electronics
over-molding
Moldflow
Online Access:https://www.mdpi.com/2072-666X/14/4/876

Similar Items

Similar Items