Reflow Soldering Capability Improvement by Utilizing TaN Interfacial Layer in 1Mbit RRAM Chip

Reflow Soldering Capability Improvement by Utilizing TaN Interfacial Layer in 1Mbit RRAM Chip

We investigated the thermal stability of a 1Mbit OxRRAM array embedded in 28 nm COMS technology. A back-end-of-line (BEOL) solution with a TaN–Ta interfacial layer was proposed to eliminate the failure rate after reflow soldering assembly at 260 °C. By utilizing a TaN–Ta interfacial layer (IL), the...

Full description

Bibliographic Details
Main Authors: Peng Yuan, Danian Dong, Xu Zheng, Guozhong Xing, Xiaoxin Xu
Format: Article
Language:English
Published: MDPI AG 2022-03-01
Series:Micromachines
Subjects:
RRAM
thermal stability
reflow soldering
retention
Online Access:https://www.mdpi.com/2072-666X/13/4/567

Similar Items

Similar Items