APA (7th ed.) Citation

Park, Y., Eom, Y., Yoo, K., & Jha, M. K. (2021). Leaching of Copper from Waste-Printed Circuit Boards (PCBs) in Sulfate Medium Using Cupric Ion and Oxygen. MDPI AG.

Chicago Style (17th ed.) Citation

Park, Yujin, Yuik Eom, Kyoungkeun Yoo, and Manis Kumar Jha. Leaching of Copper from Waste-Printed Circuit Boards (PCBs) in Sulfate Medium Using Cupric Ion and Oxygen. MDPI AG, 2021.

MLA (9th ed.) Citation

Park, Yujin, et al. Leaching of Copper from Waste-Printed Circuit Boards (PCBs) in Sulfate Medium Using Cupric Ion and Oxygen. MDPI AG, 2021.