Leaching of Copper from Waste-Printed Circuit Boards (PCBs) in Sulfate Medium Using Cupric Ion and Oxygen
In the present paper, the leaching of copper from printed circuit boards (PCBs) using sulfuric acid with Cu<sup>2+</sup> and O<sub>2</sub> is proposed. The effects of various process parameters such as agitation speed, temperature, the type and the flow rate of gas, initial C...
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MDPI AG
2021-08-01
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| Series: | Metals |
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| Online Access: | https://www.mdpi.com/2075-4701/11/9/1369 |
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| author | Yujin Park Yuik Eom Kyoungkeun Yoo Manis Kumar Jha |
| author_facet | Yujin Park Yuik Eom Kyoungkeun Yoo Manis Kumar Jha |
| author_sort | Yujin Park |
| collection | DOAJ |
| description | In the present paper, the leaching of copper from printed circuit boards (PCBs) using sulfuric acid with Cu<sup>2+</sup> and O<sub>2</sub> is proposed. The effects of various process parameters such as agitation speed, temperature, the type and the flow rate of gas, initial Cu<sup>2+</sup> concentration, and pulp density were investigated to examine the dissolution behavior of Cu from PCBs in 1 mol/L sulfuric acid. The kinetic studies were performed using the obtained leaching data. The leaching rate of Cu from PCBs was found to be higher on addition of Cu<sup>2+</sup> and O<sub>2</sub> to the leachant in comparison with the addition of O<sub>2</sub> or both Cu<sup>2+</sup> and N<sub>2</sub> in the leachant. The leaching efficiency of Cu was found to be increased with increasing agitation speed, temperature, O<sub>2</sub> flow rate, and initial Cu<sup>2+</sup> concentration and decreasing pulp density. The 96% of Cu leaching efficiency was obtained under the following conditions: sulfuric acid concentration, 1 mol/L; temperature, 90 °C; agitation speed, 600 rpm; pulp density, 1%; initial Cu<sup>2+</sup> concentration, 10,000 mg/L; and O<sub>2</sub> flow rate, 1000 cc/min. The leaching data and analyses indicate that the Cu leaching from PCBs followed the reaction-controlled model satisfactorily and determined that the activation energy was found to be 23.8 kJ/mol. Therefore, these results indicate that the sulfuric acid solution with Cu<sup>2+</sup> and O<sub>2</sub> as a mild leach medium without strong oxidants such as HNO<sub>3</sub>, H<sub>2</sub>O<sub>2</sub>, and Fe<sup>3+</sup> is valid for Cu leaching from PCBs. |
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| language | English |
| last_indexed | 2024-03-10T07:27:13Z |
| publishDate | 2021-08-01 |
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| record_format | Article |
| series | Metals |
| spelling | doaj.art-9d3012ae4d2243f9a1099483056f2b712023-11-22T14:12:52ZengMDPI AGMetals2075-47012021-08-01119136910.3390/met11091369Leaching of Copper from Waste-Printed Circuit Boards (PCBs) in Sulfate Medium Using Cupric Ion and OxygenYujin Park0Yuik Eom1Kyoungkeun Yoo2Manis Kumar Jha3Department of Energy and Resources Engineering, Korea Maritime and Ocean University (KMOU), Busan 49112, KoreaDepartment of Energy and Resources Engineering, Korea Maritime and Ocean University (KMOU), Busan 49112, KoreaDepartment of Energy and Resources Engineering, Korea Maritime and Ocean University (KMOU), Busan 49112, KoreaMetal Extraction and Recycling Division, CSIR—National Metallurgical Laboratory, Jamshedpur 831007, IndiaIn the present paper, the leaching of copper from printed circuit boards (PCBs) using sulfuric acid with Cu<sup>2+</sup> and O<sub>2</sub> is proposed. The effects of various process parameters such as agitation speed, temperature, the type and the flow rate of gas, initial Cu<sup>2+</sup> concentration, and pulp density were investigated to examine the dissolution behavior of Cu from PCBs in 1 mol/L sulfuric acid. The kinetic studies were performed using the obtained leaching data. The leaching rate of Cu from PCBs was found to be higher on addition of Cu<sup>2+</sup> and O<sub>2</sub> to the leachant in comparison with the addition of O<sub>2</sub> or both Cu<sup>2+</sup> and N<sub>2</sub> in the leachant. The leaching efficiency of Cu was found to be increased with increasing agitation speed, temperature, O<sub>2</sub> flow rate, and initial Cu<sup>2+</sup> concentration and decreasing pulp density. The 96% of Cu leaching efficiency was obtained under the following conditions: sulfuric acid concentration, 1 mol/L; temperature, 90 °C; agitation speed, 600 rpm; pulp density, 1%; initial Cu<sup>2+</sup> concentration, 10,000 mg/L; and O<sub>2</sub> flow rate, 1000 cc/min. The leaching data and analyses indicate that the Cu leaching from PCBs followed the reaction-controlled model satisfactorily and determined that the activation energy was found to be 23.8 kJ/mol. Therefore, these results indicate that the sulfuric acid solution with Cu<sup>2+</sup> and O<sub>2</sub> as a mild leach medium without strong oxidants such as HNO<sub>3</sub>, H<sub>2</sub>O<sub>2</sub>, and Fe<sup>3+</sup> is valid for Cu leaching from PCBs.https://www.mdpi.com/2075-4701/11/9/1369Cu leaching improvementprinted circuit boards (PCBs)sulfuric acidcupric ionoxygen |
| spellingShingle | Yujin Park Yuik Eom Kyoungkeun Yoo Manis Kumar Jha Leaching of Copper from Waste-Printed Circuit Boards (PCBs) in Sulfate Medium Using Cupric Ion and Oxygen Metals Cu leaching improvement printed circuit boards (PCBs) sulfuric acid cupric ion oxygen |
| title | Leaching of Copper from Waste-Printed Circuit Boards (PCBs) in Sulfate Medium Using Cupric Ion and Oxygen |
| title_full | Leaching of Copper from Waste-Printed Circuit Boards (PCBs) in Sulfate Medium Using Cupric Ion and Oxygen |
| title_fullStr | Leaching of Copper from Waste-Printed Circuit Boards (PCBs) in Sulfate Medium Using Cupric Ion and Oxygen |
| title_full_unstemmed | Leaching of Copper from Waste-Printed Circuit Boards (PCBs) in Sulfate Medium Using Cupric Ion and Oxygen |
| title_short | Leaching of Copper from Waste-Printed Circuit Boards (PCBs) in Sulfate Medium Using Cupric Ion and Oxygen |
| title_sort | leaching of copper from waste printed circuit boards pcbs in sulfate medium using cupric ion and oxygen |
| topic | Cu leaching improvement printed circuit boards (PCBs) sulfuric acid cupric ion oxygen |
| url | https://www.mdpi.com/2075-4701/11/9/1369 |
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