Leaching of Copper from Waste-Printed Circuit Boards (PCBs) in Sulfate Medium Using Cupric Ion and Oxygen

Leaching of Copper from Waste-Printed Circuit Boards (PCBs) in Sulfate Medium Using Cupric Ion and Oxygen

In the present paper, the leaching of copper from printed circuit boards (PCBs) using sulfuric acid with Cu<sup>2+</sup> and O<sub>2</sub> is proposed. The effects of various process parameters such as agitation speed, temperature, the type and the flow rate of gas, initial C...

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Bibliographic Details
Main Authors: Yujin Park, Yuik Eom, Kyoungkeun Yoo, Manis Kumar Jha
Format: Article
Language:English
Published: MDPI AG 2021-08-01
Series:Metals
Subjects:
Cu leaching improvement
printed circuit boards (PCBs)
sulfuric acid
cupric ion
oxygen
Online Access:https://www.mdpi.com/2075-4701/11/9/1369

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