Femtosecond-Laser-Ablation Dynamics in Silicon Revealed by Transient Reflectivity Change

The dynamics of ablation in monocrystalline silicon, from electron-hole plasma generation to material expansion, upon irradiation by a single femtosecond laser pulse (1030 nm, 300 fs pulse duration) at a wide range of fluences is investigated using a time-resolved microscopy technique. The reflectiv...

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Bibliographic Details
Main Authors: Tao Feng, Gong Chen, Hainian Han, Jie Qiao
Format: Article
Language:English
Published: MDPI AG 2021-12-01
Series:Micromachines
Subjects:
Online Access:https://www.mdpi.com/2072-666X/13/1/14