Analysis of sapphire- chemical mechanical polishing using digital image processing

Analysis of sapphire- chemical mechanical polishing using digital image processing

This study investigated the contact interface behavior between a wafer and a polishing pad in sapphire- chemical mechanical polishing (CMP) for considering the improvement of the removal rate. In our previous study we clarified that the linear velocity ratio, defined as the ratio of slurry flow velo...

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Bibliographic Details
Main Authors: Michio UNEDA, Keiichi TAKANO, Koji KOYAMA, Hideo AIDA, Ken-ichi ISHIKAWA
Format: Article
Language:English
Published: The Japan Society of Mechanical Engineers 2016-02-01
Series:Mechanical Engineering Journal
Subjects:
sapphire- cmp
contact interface
linear velocity ratio
removal rate
slurry film thickness
contact angle of slurry
Online Access:https://www.jstage.jst.go.jp/article/mej/3/1/3_15-00509/_pdf/-char/en

Internet

https://www.jstage.jst.go.jp/article/mej/3/1/3_15-00509/_pdf/-char/en

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