WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit Array
The performance of WR-3.4 overmoded waveguide modules containing a linear array of discrete terahertz integrated circuits is presented to verify a new power-combining technique. Custom-designed thru-line IC chips that include back-to-back broadband antenna transitions were fabricated with an area of...
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Format: | Article |
Language: | English |
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MDPI AG
2022-07-01
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Series: | Electronics |
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Online Access: | https://www.mdpi.com/2079-9292/11/13/2091 |
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author | Juhee Lee Yang Woo Kim Sanggeun Jeon Moonil Kim |
author_facet | Juhee Lee Yang Woo Kim Sanggeun Jeon Moonil Kim |
author_sort | Juhee Lee |
collection | DOAJ |
description | The performance of WR-3.4 overmoded waveguide modules containing a linear array of discrete terahertz integrated circuits is presented to verify a new power-combining technique. Custom-designed thru-line IC chips that include back-to-back broadband antenna transitions were fabricated with an area of 390 × 750 mm<sup>2</sup> for waveguide packaging. Multiple array modules were assembled to verify the repeatability in performance. The array modules exhibited almost identical amounts of insertion losses compared with single-element modules, showing the best insertion loss of 2.6 dB over a 1 dB bandwidth of 95 GHz. |
first_indexed | 2024-03-09T21:58:51Z |
format | Article |
id | doaj.art-9e9caa0bef57420da79e252a51d70fe7 |
institution | Directory Open Access Journal |
issn | 2079-9292 |
language | English |
last_indexed | 2024-03-09T21:58:51Z |
publishDate | 2022-07-01 |
publisher | MDPI AG |
record_format | Article |
series | Electronics |
spelling | doaj.art-9e9caa0bef57420da79e252a51d70fe72023-11-23T19:52:42ZengMDPI AGElectronics2079-92922022-07-011113209110.3390/electronics11132091WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit ArrayJuhee Lee0Yang Woo Kim1Sanggeun Jeon2Moonil Kim3School of Electrical Engineering, Korea University, Seoul 02841, KoreaSchool of Electrical Engineering, Korea University, Seoul 02841, KoreaSchool of Electrical Engineering, Korea University, Seoul 02841, KoreaSchool of Electrical Engineering, Korea University, Seoul 02841, KoreaThe performance of WR-3.4 overmoded waveguide modules containing a linear array of discrete terahertz integrated circuits is presented to verify a new power-combining technique. Custom-designed thru-line IC chips that include back-to-back broadband antenna transitions were fabricated with an area of 390 × 750 mm<sup>2</sup> for waveguide packaging. Multiple array modules were assembled to verify the repeatability in performance. The array modules exhibited almost identical amounts of insertion losses compared with single-element modules, showing the best insertion loss of 2.6 dB over a 1 dB bandwidth of 95 GHz.https://www.mdpi.com/2079-9292/11/13/2091terahertz waveguide modulespatial power combiningintegrated waveguide transition |
spellingShingle | Juhee Lee Yang Woo Kim Sanggeun Jeon Moonil Kim WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit Array Electronics terahertz waveguide module spatial power combining integrated waveguide transition |
title | WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit Array |
title_full | WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit Array |
title_fullStr | WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit Array |
title_full_unstemmed | WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit Array |
title_short | WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit Array |
title_sort | wr 3 4 overmoded waveguide module for the packaging of a linear integrated circuit array |
topic | terahertz waveguide module spatial power combining integrated waveguide transition |
url | https://www.mdpi.com/2079-9292/11/13/2091 |
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