WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit Array

The performance of WR-3.4 overmoded waveguide modules containing a linear array of discrete terahertz integrated circuits is presented to verify a new power-combining technique. Custom-designed thru-line IC chips that include back-to-back broadband antenna transitions were fabricated with an area of...

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Main Authors: Juhee Lee, Yang Woo Kim, Sanggeun Jeon, Moonil Kim
Format: Article
Language:English
Published: MDPI AG 2022-07-01
Series:Electronics
Subjects:
Online Access:https://www.mdpi.com/2079-9292/11/13/2091
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author Juhee Lee
Yang Woo Kim
Sanggeun Jeon
Moonil Kim
author_facet Juhee Lee
Yang Woo Kim
Sanggeun Jeon
Moonil Kim
author_sort Juhee Lee
collection DOAJ
description The performance of WR-3.4 overmoded waveguide modules containing a linear array of discrete terahertz integrated circuits is presented to verify a new power-combining technique. Custom-designed thru-line IC chips that include back-to-back broadband antenna transitions were fabricated with an area of 390 × 750 mm<sup>2</sup> for waveguide packaging. Multiple array modules were assembled to verify the repeatability in performance. The array modules exhibited almost identical amounts of insertion losses compared with single-element modules, showing the best insertion loss of 2.6 dB over a 1 dB bandwidth of 95 GHz.
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spelling doaj.art-9e9caa0bef57420da79e252a51d70fe72023-11-23T19:52:42ZengMDPI AGElectronics2079-92922022-07-011113209110.3390/electronics11132091WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit ArrayJuhee Lee0Yang Woo Kim1Sanggeun Jeon2Moonil Kim3School of Electrical Engineering, Korea University, Seoul 02841, KoreaSchool of Electrical Engineering, Korea University, Seoul 02841, KoreaSchool of Electrical Engineering, Korea University, Seoul 02841, KoreaSchool of Electrical Engineering, Korea University, Seoul 02841, KoreaThe performance of WR-3.4 overmoded waveguide modules containing a linear array of discrete terahertz integrated circuits is presented to verify a new power-combining technique. Custom-designed thru-line IC chips that include back-to-back broadband antenna transitions were fabricated with an area of 390 × 750 mm<sup>2</sup> for waveguide packaging. Multiple array modules were assembled to verify the repeatability in performance. The array modules exhibited almost identical amounts of insertion losses compared with single-element modules, showing the best insertion loss of 2.6 dB over a 1 dB bandwidth of 95 GHz.https://www.mdpi.com/2079-9292/11/13/2091terahertz waveguide modulespatial power combiningintegrated waveguide transition
spellingShingle Juhee Lee
Yang Woo Kim
Sanggeun Jeon
Moonil Kim
WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit Array
Electronics
terahertz waveguide module
spatial power combining
integrated waveguide transition
title WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit Array
title_full WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit Array
title_fullStr WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit Array
title_full_unstemmed WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit Array
title_short WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit Array
title_sort wr 3 4 overmoded waveguide module for the packaging of a linear integrated circuit array
topic terahertz waveguide module
spatial power combining
integrated waveguide transition
url https://www.mdpi.com/2079-9292/11/13/2091
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AT yangwookim wr34overmodedwaveguidemoduleforthepackagingofalinearintegratedcircuitarray
AT sanggeunjeon wr34overmodedwaveguidemoduleforthepackagingofalinearintegratedcircuitarray
AT moonilkim wr34overmodedwaveguidemoduleforthepackagingofalinearintegratedcircuitarray