Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints
This study aims to evaluate solder joint reliability under high speed impact tests using nanoindentation properties of intermetallic compounds (IMCs) at the joint interface. Sn–Ag based solder joints with different kinds of interfacial IMCs were obtained through the design of solder alloy/substrate...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2020-07-01
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| Series: | Nanomaterials |
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| Online Access: | https://www.mdpi.com/2079-4991/10/8/1456 |
| _version_ | 1797561387326636032 |
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| author | Jenn-Ming Song Bo-Chang Huang David Tarng Chih-Pin Hung Kiyokazu Yasuda |
| author_facet | Jenn-Ming Song Bo-Chang Huang David Tarng Chih-Pin Hung Kiyokazu Yasuda |
| author_sort | Jenn-Ming Song |
| collection | DOAJ |
| description | This study aims to evaluate solder joint reliability under high speed impact tests using nanoindentation properties of intermetallic compounds (IMCs) at the joint interface. Sn–Ag based solder joints with different kinds of interfacial IMCs were obtained through the design of solder alloy/substrate material combinations. Nanoindentation was applied to investigate the mechanical properties of IMCs, including hardness, Young’s modulus, work hardening exponent, yield strength, and plastic ability. Experimental results suggest that nanoindentation responses of IMCs at joint interface definitely dominates joint impact performance. The greater the plastic ability the interfacial IMC exhibits, the superior impact energy the solder joints possess. The concept of mechanical and geometrical discontinuities was also proposed to explain brittle fracture of the solder joints with bi-layer interfacial IMCs subject to impact load. |
| first_indexed | 2024-03-10T18:13:14Z |
| format | Article |
| id | doaj.art-9f82eca9dc6f4136b3369f920e0902a3 |
| institution | Directory Open Access Journal |
| issn | 2079-4991 |
| language | English |
| last_indexed | 2024-03-10T18:13:14Z |
| publishDate | 2020-07-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Nanomaterials |
| spelling | doaj.art-9f82eca9dc6f4136b3369f920e0902a32023-11-20T07:55:16ZengMDPI AGNanomaterials2079-49912020-07-01108145610.3390/nano10081456Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder JointsJenn-Ming Song0Bo-Chang Huang1David Tarng2Chih-Pin Hung3Kiyokazu Yasuda4Department of Materials Science and Engineering, National Chung Hsing University, Taichung 402, TaiwanDepartment of Materials Science and Engineering, National Dong Hwa University, Hualien 974, TaiwanAdvanced Semiconductor Engineering Group, Kaohsiung 811, TaiwanAdvanced Semiconductor Engineering Group, Kaohsiung 811, TaiwanDivision of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University, Osaka 565-0817, JapanThis study aims to evaluate solder joint reliability under high speed impact tests using nanoindentation properties of intermetallic compounds (IMCs) at the joint interface. Sn–Ag based solder joints with different kinds of interfacial IMCs were obtained through the design of solder alloy/substrate material combinations. Nanoindentation was applied to investigate the mechanical properties of IMCs, including hardness, Young’s modulus, work hardening exponent, yield strength, and plastic ability. Experimental results suggest that nanoindentation responses of IMCs at joint interface definitely dominates joint impact performance. The greater the plastic ability the interfacial IMC exhibits, the superior impact energy the solder joints possess. The concept of mechanical and geometrical discontinuities was also proposed to explain brittle fracture of the solder joints with bi-layer interfacial IMCs subject to impact load.https://www.mdpi.com/2079-4991/10/8/1456solder jointintermetallic compoundsnanoindentationimpact test |
| spellingShingle | Jenn-Ming Song Bo-Chang Huang David Tarng Chih-Pin Hung Kiyokazu Yasuda Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints Nanomaterials solder joint intermetallic compounds nanoindentation impact test |
| title | Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints |
| title_full | Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints |
| title_fullStr | Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints |
| title_full_unstemmed | Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints |
| title_short | Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints |
| title_sort | relationship between nanomechanical responses of interfacial intermetallic compound layers and impact reliability of solder joints |
| topic | solder joint intermetallic compounds nanoindentation impact test |
| url | https://www.mdpi.com/2079-4991/10/8/1456 |
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