Three-Dimensional Chip Imaging
Main Author: | |
---|---|
Format: | Article |
Language: | English |
Published: |
Elsevier
2020-05-01
|
Series: | Engineering |
Online Access: | http://www.sciencedirect.com/science/article/pii/S2095809920300655 |
_version_ | 1818486433461043200 |
---|---|
author | Marcus Woo |
author_facet | Marcus Woo |
author_sort | Marcus Woo |
collection | DOAJ |
first_indexed | 2024-12-10T16:22:57Z |
format | Article |
id | doaj.art-a07d910b3ae44bcb9854c3b52f64c98c |
institution | Directory Open Access Journal |
issn | 2095-8099 |
language | English |
last_indexed | 2024-12-10T16:22:57Z |
publishDate | 2020-05-01 |
publisher | Elsevier |
record_format | Article |
series | Engineering |
spelling | doaj.art-a07d910b3ae44bcb9854c3b52f64c98c2022-12-22T01:41:46ZengElsevierEngineering2095-80992020-05-0165485486Three-Dimensional Chip ImagingMarcus Woo0Senior Technology Writerhttp://www.sciencedirect.com/science/article/pii/S2095809920300655 |
spellingShingle | Marcus Woo Three-Dimensional Chip Imaging Engineering |
title | Three-Dimensional Chip Imaging |
title_full | Three-Dimensional Chip Imaging |
title_fullStr | Three-Dimensional Chip Imaging |
title_full_unstemmed | Three-Dimensional Chip Imaging |
title_short | Three-Dimensional Chip Imaging |
title_sort | three dimensional chip imaging |
url | http://www.sciencedirect.com/science/article/pii/S2095809920300655 |
work_keys_str_mv | AT marcuswoo threedimensionalchipimaging |