Integrated Electromagnetic-Thermal Approach to Simulate a GaN-Based Monolithic Half-Bridge for Automotive DC-DC Converter
New technological and packaging solutions are more and more being employed for power semiconductor switches in an automotive environment, especially the SiC- and GaN-based ones. In this framework, new front-end and back-end solutions have been developed, and many more are in the design stage. New an...
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| Format: | Article |
| Language: | English |
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MDPI AG
2021-09-01
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| Series: | Applied Sciences |
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| Online Access: | https://www.mdpi.com/2076-3417/11/18/8302 |
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| author | Giuseppe Mauromicale Alessandro Sitta Michele Calabretta Salvatore Massimo Oliveri Gaetano Sequenzia |
| author_facet | Giuseppe Mauromicale Alessandro Sitta Michele Calabretta Salvatore Massimo Oliveri Gaetano Sequenzia |
| author_sort | Giuseppe Mauromicale |
| collection | DOAJ |
| description | New technological and packaging solutions are more and more being employed for power semiconductor switches in an automotive environment, especially the SiC- and GaN-based ones. In this framework, new front-end and back-end solutions have been developed, and many more are in the design stage. New and more integrated power devices are useful to guarantee the performances in electric vehicles, in terms of thermal management, size reduction, and low power losses. In this paper, a GaN-based system in package solution is simulated to assess the structure temperature submitted to a Joule heating power loss. The monolithic package solution involves a half-bridge topology, as well as a driver logic. A novel integrated electromagnetic and thermal method, based on finite element simulations, is proposed in this work. More specifically, dynamic electric power losses of the copper interconnections are computed in the first simulation stage, by an electromagnetic model. In the second stage, the obtained losses’ geometrical map is imported in the finite element thermal simulation, and it is considered as the input. Hence, the temperature distribution of the package’s copper traces is computed. The simulation model verifies the proper design of copper traces. The obtained temperature swing avoids any thermal-related reliability bottleneck. |
| first_indexed | 2024-03-10T07:56:18Z |
| format | Article |
| id | doaj.art-a0de6dee00804a36991c93670eb9ef65 |
| institution | Directory Open Access Journal |
| issn | 2076-3417 |
| language | English |
| last_indexed | 2024-03-10T07:56:18Z |
| publishDate | 2021-09-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Applied Sciences |
| spelling | doaj.art-a0de6dee00804a36991c93670eb9ef652023-11-22T11:50:35ZengMDPI AGApplied Sciences2076-34172021-09-011118830210.3390/app11188302Integrated Electromagnetic-Thermal Approach to Simulate a GaN-Based Monolithic Half-Bridge for Automotive DC-DC ConverterGiuseppe Mauromicale0Alessandro Sitta1Michele Calabretta2Salvatore Massimo Oliveri3Gaetano Sequenzia4Automotive and Discrete Group, R&D Department, STMicroelectronics, 95121 Catania, ItalyAutomotive and Discrete Group, R&D Department, STMicroelectronics, 95121 Catania, ItalyAutomotive and Discrete Group, R&D Department, STMicroelectronics, 95121 Catania, ItalyDipartimento di Ingegneria Elettrica, Elettronica ed Informatica (DIEEI), Università degli Studi di Catania, 95125 Catania, ItalyDipartimento di Ingegneria Elettrica, Elettronica ed Informatica (DIEEI), Università degli Studi di Catania, 95125 Catania, ItalyNew technological and packaging solutions are more and more being employed for power semiconductor switches in an automotive environment, especially the SiC- and GaN-based ones. In this framework, new front-end and back-end solutions have been developed, and many more are in the design stage. New and more integrated power devices are useful to guarantee the performances in electric vehicles, in terms of thermal management, size reduction, and low power losses. In this paper, a GaN-based system in package solution is simulated to assess the structure temperature submitted to a Joule heating power loss. The monolithic package solution involves a half-bridge topology, as well as a driver logic. A novel integrated electromagnetic and thermal method, based on finite element simulations, is proposed in this work. More specifically, dynamic electric power losses of the copper interconnections are computed in the first simulation stage, by an electromagnetic model. In the second stage, the obtained losses’ geometrical map is imported in the finite element thermal simulation, and it is considered as the input. Hence, the temperature distribution of the package’s copper traces is computed. The simulation model verifies the proper design of copper traces. The obtained temperature swing avoids any thermal-related reliability bottleneck.https://www.mdpi.com/2076-3417/11/18/8302automotivegallium nitridepower devicesintegrated packagefinite element simulationelectromagnetic simulation |
| spellingShingle | Giuseppe Mauromicale Alessandro Sitta Michele Calabretta Salvatore Massimo Oliveri Gaetano Sequenzia Integrated Electromagnetic-Thermal Approach to Simulate a GaN-Based Monolithic Half-Bridge for Automotive DC-DC Converter Applied Sciences automotive gallium nitride power devices integrated package finite element simulation electromagnetic simulation |
| title | Integrated Electromagnetic-Thermal Approach to Simulate a GaN-Based Monolithic Half-Bridge for Automotive DC-DC Converter |
| title_full | Integrated Electromagnetic-Thermal Approach to Simulate a GaN-Based Monolithic Half-Bridge for Automotive DC-DC Converter |
| title_fullStr | Integrated Electromagnetic-Thermal Approach to Simulate a GaN-Based Monolithic Half-Bridge for Automotive DC-DC Converter |
| title_full_unstemmed | Integrated Electromagnetic-Thermal Approach to Simulate a GaN-Based Monolithic Half-Bridge for Automotive DC-DC Converter |
| title_short | Integrated Electromagnetic-Thermal Approach to Simulate a GaN-Based Monolithic Half-Bridge for Automotive DC-DC Converter |
| title_sort | integrated electromagnetic thermal approach to simulate a gan based monolithic half bridge for automotive dc dc converter |
| topic | automotive gallium nitride power devices integrated package finite element simulation electromagnetic simulation |
| url | https://www.mdpi.com/2076-3417/11/18/8302 |
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