Roll Bonding Properties of Al/Cu Bimetallic Laminates Fabricated by the Roll Bonding Technique
Roll bonding (RB) of bimetal laminates is a solid phase method of bonding and has been widely used in the manufacturing of layered strips. This process is widely used for brazing sheet for automotive, aerospace, vessel, and electrical industries. In this study, 1-mm bimetallic aluminum 1050 and pure...
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MDPI AG
2017-06-01
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Online Access: | http://www.mdpi.com/2227-7080/5/2/32 |
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author | Mohammad Heydari Vini Saeed Daneshmand Mostafa Forooghi |
author_facet | Mohammad Heydari Vini Saeed Daneshmand Mostafa Forooghi |
author_sort | Mohammad Heydari Vini |
collection | DOAJ |
description | Roll bonding (RB) of bimetal laminates is a solid phase method of bonding and has been widely used in the manufacturing of layered strips. This process is widely used for brazing sheet for automotive, aerospace, vessel, and electrical industries. In this study, 1-mm bimetallic aluminum 1050 and pure copper (Al/Cu) laminates were produced using the roll bonding (RB) process. The RB process was carried out with thickness reduction ratios of 10%, 20%, and 30%, separately. Particular attention was focused on the bonding of the interface between Al and Cu layers. The optimization of thickness reduction ratios was obtained for the improvement of the bond strength of bimetallic laminates during the RB process. Also, the RB method was simulated using finite element simulation in ABAQUS software. Finite Element (FE) simulation was used to model the deformation of bimetallic laminates for various thickness reduction ratios, rolling temperatures, and tensile stresses. Particular attention was focused on the rolling pressure of Al and Cu layers in the simulation. The results show that the stress distribution in the bimetal Al/Cu laminates is an asymmetrical distribution. Moreover, the bonding strength of samples was obtained using the peeling test. Also, the fracture surface of roll bonded samples around the interface of laminates after the tensile test was studied to investigate the bonding quality by scanning electron microscopy (SEM). |
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issn | 2227-7080 |
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spelling | doaj.art-a318b19c15f04b8cbfef02a16c4f7b332022-12-21T18:59:36ZengMDPI AGTechnologies2227-70802017-06-01523210.3390/technologies5020032technologies5020032Roll Bonding Properties of Al/Cu Bimetallic Laminates Fabricated by the Roll Bonding TechniqueMohammad Heydari Vini0Saeed Daneshmand1Mostafa Forooghi2Department of Mechanical Engineering, Mobarakeh Branch, Islamic Azad University, Mobarakeh, Isfahan 8631656451, IranDepartment of Mechanical Engineering, Majlesi Branch, Islamic Azad University, Majlesi, Isfahan 8159716778, IranDepartment of Mechanical Engineering, Majlesi Branch, Islamic Azad University, Majlesi, Isfahan 8159716778, IranRoll bonding (RB) of bimetal laminates is a solid phase method of bonding and has been widely used in the manufacturing of layered strips. This process is widely used for brazing sheet for automotive, aerospace, vessel, and electrical industries. In this study, 1-mm bimetallic aluminum 1050 and pure copper (Al/Cu) laminates were produced using the roll bonding (RB) process. The RB process was carried out with thickness reduction ratios of 10%, 20%, and 30%, separately. Particular attention was focused on the bonding of the interface between Al and Cu layers. The optimization of thickness reduction ratios was obtained for the improvement of the bond strength of bimetallic laminates during the RB process. Also, the RB method was simulated using finite element simulation in ABAQUS software. Finite Element (FE) simulation was used to model the deformation of bimetallic laminates for various thickness reduction ratios, rolling temperatures, and tensile stresses. Particular attention was focused on the rolling pressure of Al and Cu layers in the simulation. The results show that the stress distribution in the bimetal Al/Cu laminates is an asymmetrical distribution. Moreover, the bonding strength of samples was obtained using the peeling test. Also, the fracture surface of roll bonded samples around the interface of laminates after the tensile test was studied to investigate the bonding quality by scanning electron microscopy (SEM).http://www.mdpi.com/2227-7080/5/2/32roll bonding (RB)bond strengthbimetal laminatespeeling testFinite Element Method (FEM) |
spellingShingle | Mohammad Heydari Vini Saeed Daneshmand Mostafa Forooghi Roll Bonding Properties of Al/Cu Bimetallic Laminates Fabricated by the Roll Bonding Technique Technologies roll bonding (RB) bond strength bimetal laminates peeling test Finite Element Method (FEM) |
title | Roll Bonding Properties of Al/Cu Bimetallic Laminates Fabricated by the Roll Bonding Technique |
title_full | Roll Bonding Properties of Al/Cu Bimetallic Laminates Fabricated by the Roll Bonding Technique |
title_fullStr | Roll Bonding Properties of Al/Cu Bimetallic Laminates Fabricated by the Roll Bonding Technique |
title_full_unstemmed | Roll Bonding Properties of Al/Cu Bimetallic Laminates Fabricated by the Roll Bonding Technique |
title_short | Roll Bonding Properties of Al/Cu Bimetallic Laminates Fabricated by the Roll Bonding Technique |
title_sort | roll bonding properties of al cu bimetallic laminates fabricated by the roll bonding technique |
topic | roll bonding (RB) bond strength bimetal laminates peeling test Finite Element Method (FEM) |
url | http://www.mdpi.com/2227-7080/5/2/32 |
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