Interface Optimization and Transport Modulation of Sm<sub>2</sub>O<sub>3</sub>/InP Metal Oxide Semiconductor Capacitors with Atomic Layer Deposition-Derived Laminated Interlayer

In this paper, the effect of atomic layer deposition-derived laminated interlayer on the interface chemistry and transport characteristics of sputtering-deposited Sm<sub>2</sub>O<sub>3</sub>/InP gate stacks have been investigated systematically. Based on X-ray photoelectron s...

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Main Authors: Jinyu Lu, Gang He, Jin Yan, Zhenxiang Dai, Ganhong Zheng, Shanshan Jiang, Lesheng Qiao, Qian Gao, Zebo Fang
Format: Article
Language:English
Published: MDPI AG 2021-12-01
Series:Nanomaterials
Subjects:
Online Access:https://www.mdpi.com/2079-4991/11/12/3443
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author Jinyu Lu
Gang He
Jin Yan
Zhenxiang Dai
Ganhong Zheng
Shanshan Jiang
Lesheng Qiao
Qian Gao
Zebo Fang
author_facet Jinyu Lu
Gang He
Jin Yan
Zhenxiang Dai
Ganhong Zheng
Shanshan Jiang
Lesheng Qiao
Qian Gao
Zebo Fang
author_sort Jinyu Lu
collection DOAJ
description In this paper, the effect of atomic layer deposition-derived laminated interlayer on the interface chemistry and transport characteristics of sputtering-deposited Sm<sub>2</sub>O<sub>3</sub>/InP gate stacks have been investigated systematically. Based on X-ray photoelectron spectroscopy (XPS) measurements, it can be noted that ALD-derived Al<sub>2</sub>O<sub>3</sub> interface passivation layer significantly prevents the appearance of substrate diffusion oxides and substantially optimizes gate dielectric performance. The leakage current experimental results confirm that the Sm<sub>2</sub>O<sub>3</sub>/Al<sub>2</sub>O<sub>3</sub>/InP stacked gate dielectric structure exhibits a lower leakage current density than the other samples, reaching a value of 2.87 × 10<sup>−6</sup> A/cm<sup>2</sup>. In addition, conductivity analysis shows that high-quality metal oxide semiconductor capacitors based on Sm<sub>2</sub>O<sub>3</sub>/Al<sub>2</sub>O<sub>3</sub>/InP gate stacks have the lowest interfacial density of states (<i>D</i><sub>it</sub>) value of 1.05 × 10<sup>13</sup> cm<sup>−2</sup> eV<sup>−1</sup>. The conduction mechanisms of the InP-based MOS capacitors at low temperatures are not yet known, and to further explore the electron transport in InP-based MOS capacitors with different stacked gate dielectric structures, we placed samples for leakage current measurements at low varying temperatures (77–227 K). Based on the measurement results, Sm<sub>2</sub>O<sub>3</sub>/Al<sub>2</sub>O<sub>3</sub>/InP stacked gate dielectric is a promising candidate for InP-based metal oxide semiconductor field-effect-transistor devices (MOSFET) in the future.
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spelling doaj.art-a335028b213d436798c98c6e39035a912023-11-23T09:52:41ZengMDPI AGNanomaterials2079-49912021-12-011112344310.3390/nano11123443Interface Optimization and Transport Modulation of Sm<sub>2</sub>O<sub>3</sub>/InP Metal Oxide Semiconductor Capacitors with Atomic Layer Deposition-Derived Laminated InterlayerJinyu Lu0Gang He1Jin Yan2Zhenxiang Dai3Ganhong Zheng4Shanshan Jiang5Lesheng Qiao6Qian Gao7Zebo Fang8School of Materials Science and Engineering, Anhui University, Hefei 230601, ChinaSchool of Materials Science and Engineering, Anhui University, Hefei 230601, ChinaSchool of Materials Science and Engineering, Anhui University, Hefei 230601, ChinaSchool of Physics and Optoelectronics Engineering, Anhui University, Hefei 230601, ChinaSchool of Materials Science and Engineering, Anhui University, Hefei 230601, ChinaSchool of Integration Circuits, Anhui University, Hefei 230601, ChinaSchool of Materials Science and Engineering, Anhui University, Hefei 230601, ChinaSchool of Materials Science and Engineering, Anhui University, Hefei 230601, ChinaSchool of Mathematical Information, Shaoxing University, Shaoxing 312000, ChinaIn this paper, the effect of atomic layer deposition-derived laminated interlayer on the interface chemistry and transport characteristics of sputtering-deposited Sm<sub>2</sub>O<sub>3</sub>/InP gate stacks have been investigated systematically. Based on X-ray photoelectron spectroscopy (XPS) measurements, it can be noted that ALD-derived Al<sub>2</sub>O<sub>3</sub> interface passivation layer significantly prevents the appearance of substrate diffusion oxides and substantially optimizes gate dielectric performance. The leakage current experimental results confirm that the Sm<sub>2</sub>O<sub>3</sub>/Al<sub>2</sub>O<sub>3</sub>/InP stacked gate dielectric structure exhibits a lower leakage current density than the other samples, reaching a value of 2.87 × 10<sup>−6</sup> A/cm<sup>2</sup>. In addition, conductivity analysis shows that high-quality metal oxide semiconductor capacitors based on Sm<sub>2</sub>O<sub>3</sub>/Al<sub>2</sub>O<sub>3</sub>/InP gate stacks have the lowest interfacial density of states (<i>D</i><sub>it</sub>) value of 1.05 × 10<sup>13</sup> cm<sup>−2</sup> eV<sup>−1</sup>. The conduction mechanisms of the InP-based MOS capacitors at low temperatures are not yet known, and to further explore the electron transport in InP-based MOS capacitors with different stacked gate dielectric structures, we placed samples for leakage current measurements at low varying temperatures (77–227 K). Based on the measurement results, Sm<sub>2</sub>O<sub>3</sub>/Al<sub>2</sub>O<sub>3</sub>/InP stacked gate dielectric is a promising candidate for InP-based metal oxide semiconductor field-effect-transistor devices (MOSFET) in the future.https://www.mdpi.com/2079-4991/11/12/3443MOS capacitorsSm<sub>2</sub>O<sub>3</sub> high-k gate dielectricatomic layer depositionconduction mechanismsinterface state density
spellingShingle Jinyu Lu
Gang He
Jin Yan
Zhenxiang Dai
Ganhong Zheng
Shanshan Jiang
Lesheng Qiao
Qian Gao
Zebo Fang
Interface Optimization and Transport Modulation of Sm<sub>2</sub>O<sub>3</sub>/InP Metal Oxide Semiconductor Capacitors with Atomic Layer Deposition-Derived Laminated Interlayer
Nanomaterials
MOS capacitors
Sm<sub>2</sub>O<sub>3</sub> high-k gate dielectric
atomic layer deposition
conduction mechanisms
interface state density
title Interface Optimization and Transport Modulation of Sm<sub>2</sub>O<sub>3</sub>/InP Metal Oxide Semiconductor Capacitors with Atomic Layer Deposition-Derived Laminated Interlayer
title_full Interface Optimization and Transport Modulation of Sm<sub>2</sub>O<sub>3</sub>/InP Metal Oxide Semiconductor Capacitors with Atomic Layer Deposition-Derived Laminated Interlayer
title_fullStr Interface Optimization and Transport Modulation of Sm<sub>2</sub>O<sub>3</sub>/InP Metal Oxide Semiconductor Capacitors with Atomic Layer Deposition-Derived Laminated Interlayer
title_full_unstemmed Interface Optimization and Transport Modulation of Sm<sub>2</sub>O<sub>3</sub>/InP Metal Oxide Semiconductor Capacitors with Atomic Layer Deposition-Derived Laminated Interlayer
title_short Interface Optimization and Transport Modulation of Sm<sub>2</sub>O<sub>3</sub>/InP Metal Oxide Semiconductor Capacitors with Atomic Layer Deposition-Derived Laminated Interlayer
title_sort interface optimization and transport modulation of sm sub 2 sub o sub 3 sub inp metal oxide semiconductor capacitors with atomic layer deposition derived laminated interlayer
topic MOS capacitors
Sm<sub>2</sub>O<sub>3</sub> high-k gate dielectric
atomic layer deposition
conduction mechanisms
interface state density
url https://www.mdpi.com/2079-4991/11/12/3443
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