A Study on Biocompatible Polymer-Based Packaging of Neural Interface for Chronic Implantation

This paper proposed and verified the use of polymer-based packaging to implement the chronic implantation of neural interfaces using a combination of a commercial thermal epoxy and a thin parylene film. The packaging’s characteristics and the performance of the vulnerable interface between the therm...

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Main Authors: HyungDal Park, Wonsuk Choi, Seonghwan Oh, Yong-Jun Kim, Seonho Seok, Jinseok Kim
Format: Article
Language:English
Published: MDPI AG 2022-03-01
Series:Micromachines
Subjects:
Online Access:https://www.mdpi.com/2072-666X/13/4/516
_version_ 1797434377087483904
author HyungDal Park
Wonsuk Choi
Seonghwan Oh
Yong-Jun Kim
Seonho Seok
Jinseok Kim
author_facet HyungDal Park
Wonsuk Choi
Seonghwan Oh
Yong-Jun Kim
Seonho Seok
Jinseok Kim
author_sort HyungDal Park
collection DOAJ
description This paper proposed and verified the use of polymer-based packaging to implement the chronic implantation of neural interfaces using a combination of a commercial thermal epoxy and a thin parylene film. The packaging’s characteristics and the performance of the vulnerable interface between the thermal epoxy layer and polyimide layer, which is mainly used for neural electrodes and an FPCB, were evaluated through in vitro, in vivo, and acceleration experiments. The performance of neural interfaces—composed of the combination of the thermal epoxy and thin parylene film deposition as encapsulation packaging—was evaluated by using signal acquisition experiments based on artificial stimulation signal transmissions through in vitro and in vivo experiments. It has been found that, when commercial thermal epoxy normally cured at room temperature was cured at higher temperatures of 45 °C and 65 °C, not only is its lifetime increased with about twice the room-temperature-based curing conditions but also an interfacial adhesion is higher with more than twice the room-temperature-based curing conditions. In addition, through in vivo experiments using rats, it was confirmed that bodily fluids did not flow into the interface between the thermal epoxy and FPCB for up to 18 months, and it was verified that the rats maintained healthy conditions without occurring an immune response in the body to the thin parylene film deposition on the packaging’s surface.
first_indexed 2024-03-09T10:31:21Z
format Article
id doaj.art-a34a877929524bebb4f11f985c7561c9
institution Directory Open Access Journal
issn 2072-666X
language English
last_indexed 2024-03-09T10:31:21Z
publishDate 2022-03-01
publisher MDPI AG
record_format Article
series Micromachines
spelling doaj.art-a34a877929524bebb4f11f985c7561c92023-12-01T21:14:27ZengMDPI AGMicromachines2072-666X2022-03-0113451610.3390/mi13040516A Study on Biocompatible Polymer-Based Packaging of Neural Interface for Chronic ImplantationHyungDal Park0Wonsuk Choi1Seonghwan Oh2Yong-Jun Kim3Seonho Seok4Jinseok Kim5Center for Bionics, Korea Institute of Science and Technology (KIST), Seoul 02792, KoreaCenter for Bionics, Korea Institute of Science and Technology (KIST), Seoul 02792, KoreaCenter for Bionics, Korea Institute of Science and Technology (KIST), Seoul 02792, KoreaSchool of Mechanical Engineering, Yonsei University, Seoul 03722, KoreaCenter for Nanoscience and Nanotechnology (C2N), University-Paris-Saclay, 91400 Orsay, FranceCenter for Bionics, Korea Institute of Science and Technology (KIST), Seoul 02792, KoreaThis paper proposed and verified the use of polymer-based packaging to implement the chronic implantation of neural interfaces using a combination of a commercial thermal epoxy and a thin parylene film. The packaging’s characteristics and the performance of the vulnerable interface between the thermal epoxy layer and polyimide layer, which is mainly used for neural electrodes and an FPCB, were evaluated through in vitro, in vivo, and acceleration experiments. The performance of neural interfaces—composed of the combination of the thermal epoxy and thin parylene film deposition as encapsulation packaging—was evaluated by using signal acquisition experiments based on artificial stimulation signal transmissions through in vitro and in vivo experiments. It has been found that, when commercial thermal epoxy normally cured at room temperature was cured at higher temperatures of 45 °C and 65 °C, not only is its lifetime increased with about twice the room-temperature-based curing conditions but also an interfacial adhesion is higher with more than twice the room-temperature-based curing conditions. In addition, through in vivo experiments using rats, it was confirmed that bodily fluids did not flow into the interface between the thermal epoxy and FPCB for up to 18 months, and it was verified that the rats maintained healthy conditions without occurring an immune response in the body to the thin parylene film deposition on the packaging’s surface.https://www.mdpi.com/2072-666X/13/4/516polymer packagingneural interfacechronic implantation
spellingShingle HyungDal Park
Wonsuk Choi
Seonghwan Oh
Yong-Jun Kim
Seonho Seok
Jinseok Kim
A Study on Biocompatible Polymer-Based Packaging of Neural Interface for Chronic Implantation
Micromachines
polymer packaging
neural interface
chronic implantation
title A Study on Biocompatible Polymer-Based Packaging of Neural Interface for Chronic Implantation
title_full A Study on Biocompatible Polymer-Based Packaging of Neural Interface for Chronic Implantation
title_fullStr A Study on Biocompatible Polymer-Based Packaging of Neural Interface for Chronic Implantation
title_full_unstemmed A Study on Biocompatible Polymer-Based Packaging of Neural Interface for Chronic Implantation
title_short A Study on Biocompatible Polymer-Based Packaging of Neural Interface for Chronic Implantation
title_sort study on biocompatible polymer based packaging of neural interface for chronic implantation
topic polymer packaging
neural interface
chronic implantation
url https://www.mdpi.com/2072-666X/13/4/516
work_keys_str_mv AT hyungdalpark astudyonbiocompatiblepolymerbasedpackagingofneuralinterfaceforchronicimplantation
AT wonsukchoi astudyonbiocompatiblepolymerbasedpackagingofneuralinterfaceforchronicimplantation
AT seonghwanoh astudyonbiocompatiblepolymerbasedpackagingofneuralinterfaceforchronicimplantation
AT yongjunkim astudyonbiocompatiblepolymerbasedpackagingofneuralinterfaceforchronicimplantation
AT seonhoseok astudyonbiocompatiblepolymerbasedpackagingofneuralinterfaceforchronicimplantation
AT jinseokkim astudyonbiocompatiblepolymerbasedpackagingofneuralinterfaceforchronicimplantation
AT hyungdalpark studyonbiocompatiblepolymerbasedpackagingofneuralinterfaceforchronicimplantation
AT wonsukchoi studyonbiocompatiblepolymerbasedpackagingofneuralinterfaceforchronicimplantation
AT seonghwanoh studyonbiocompatiblepolymerbasedpackagingofneuralinterfaceforchronicimplantation
AT yongjunkim studyonbiocompatiblepolymerbasedpackagingofneuralinterfaceforchronicimplantation
AT seonhoseok studyonbiocompatiblepolymerbasedpackagingofneuralinterfaceforchronicimplantation
AT jinseokkim studyonbiocompatiblepolymerbasedpackagingofneuralinterfaceforchronicimplantation