Via-Monopole Based Quasi Yagi-Uda Antenna for W-Band Applications using Through Glass Silicon via (TGSV) Technology

Via-Monopole Based Quasi Yagi-Uda Antenna for W-Band Applications using Through Glass Silicon via (TGSV) Technology

This paper presents a W-band planar type via-monopole based quasi Yagi-Uda antenna using metal coated through glass silicon via structures. The antenna was designed and fabricated on 350 μm thick borosilicate glass substrate, which has very low dielectric loss compared with silicon at mil...

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Bibliographic Details
Main Authors: Aqeel Hussain Naqvi, Jeong-Heum Park, Chang-Wook Baek, Sungjoon Lim
Format: Article
Language:English
Published: IEEE 2020-01-01
Series:IEEE Access
Subjects:
Borosilicate-glass
end-fire
Yagi-Uda antenna
through glass silicon via (TGSV)
Online Access:https://ieeexplore.ieee.org/document/8951160/

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