Microstructure Evolution and Shear Property of Cu-In Transient Liquid Phase Sintering Joints
Transient liquid phase sintering (TLPS) is a promising joining technology that can achieve high temperature resistant solder joints at low temperature, showing excellent potential in power electronics. In this work, Cu/Cu-In/Cu solder joints were successfully prepared by TLPS process. The effects of...
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| Format: | Article |
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Frontiers Media S.A.
2021-06-01
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| Series: | Frontiers in Materials |
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| Online Access: | https://www.frontiersin.org/articles/10.3389/fmats.2021.658464/full |
| _version_ | 1818601315780001792 |
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| author | Bang Jiang Qiaoxin Zhang Lin Shi Chundong Zhu Chundong Zhu Zhiwen Chen Li Liu Yan Shi |
| author_facet | Bang Jiang Qiaoxin Zhang Lin Shi Chundong Zhu Chundong Zhu Zhiwen Chen Li Liu Yan Shi |
| author_sort | Bang Jiang |
| collection | DOAJ |
| description | Transient liquid phase sintering (TLPS) is a promising joining technology that can achieve high temperature resistant solder joints at low temperature, showing excellent potential in power electronics. In this work, Cu/Cu-In/Cu solder joints were successfully prepared by TLPS process. The effects of bonding pressure and holding time on the microstructure and shear strength of Cu-In TLPS joints at 260 and 320°C were studied. The results showed that as bonding pressure increased from 0.1–0.6 MPa, the porosity decreased and shear strength increased significantly. No obvious change was found as bonding pressure continued to increase to 1 MPa. As holding time increased at 260°C, Cu11In9 was formed and gradually transformed to Cu2In that can withstand elevated temperature. Meanwhile, the porosity decreased while shear strength increased. It was calculated that volume expansion (12.74%) occurred during the phase transition from Cu11In9 to Cu2In. When bonding temperature increased to 320°C, only Cu2In was detected and then gradually transformed to Cu7In3 with the growing holding time. As holding time reached 120 min, their porosity increased and lead to weak shear strength due to volume shrinkage (15.43%) during the phase transition from Cu2In to Cu7In3. |
| first_indexed | 2024-12-16T12:49:26Z |
| format | Article |
| id | doaj.art-a4969f49b4b44adb984df2f8db9f070b |
| institution | Directory Open Access Journal |
| issn | 2296-8016 |
| language | English |
| last_indexed | 2024-12-16T12:49:26Z |
| publishDate | 2021-06-01 |
| publisher | Frontiers Media S.A. |
| record_format | Article |
| series | Frontiers in Materials |
| spelling | doaj.art-a4969f49b4b44adb984df2f8db9f070b2022-12-21T22:31:12ZengFrontiers Media S.A.Frontiers in Materials2296-80162021-06-01810.3389/fmats.2021.658464658464Microstructure Evolution and Shear Property of Cu-In Transient Liquid Phase Sintering JointsBang Jiang0Qiaoxin Zhang1Lin Shi2Chundong Zhu3Chundong Zhu4Zhiwen Chen5Li Liu6Yan Shi7School of Materials Science and Engineering, Wuhan University of Technology, Wuhan, ChinaSchool of Materials Science and Engineering, Wuhan University of Technology, Wuhan, ChinaSchool of Materials Science and Engineering, Wuhan University of Technology, Wuhan, ChinaSchool of Materials Science and Engineering, Wuhan University of Technology, Wuhan, ChinaSuizhou-WIT Industry Research Institute, Suizhou, ChinaThe Institute of Technological Science, Wuhan University, Wuhan, ChinaSchool of Materials Science and Engineering, Wuhan University of Technology, Wuhan, ChinaChangjiang River Scientific Research Institute of Changjiang Water Resources Commission, Wuhan, ChinaTransient liquid phase sintering (TLPS) is a promising joining technology that can achieve high temperature resistant solder joints at low temperature, showing excellent potential in power electronics. In this work, Cu/Cu-In/Cu solder joints were successfully prepared by TLPS process. The effects of bonding pressure and holding time on the microstructure and shear strength of Cu-In TLPS joints at 260 and 320°C were studied. The results showed that as bonding pressure increased from 0.1–0.6 MPa, the porosity decreased and shear strength increased significantly. No obvious change was found as bonding pressure continued to increase to 1 MPa. As holding time increased at 260°C, Cu11In9 was formed and gradually transformed to Cu2In that can withstand elevated temperature. Meanwhile, the porosity decreased while shear strength increased. It was calculated that volume expansion (12.74%) occurred during the phase transition from Cu11In9 to Cu2In. When bonding temperature increased to 320°C, only Cu2In was detected and then gradually transformed to Cu7In3 with the growing holding time. As holding time reached 120 min, their porosity increased and lead to weak shear strength due to volume shrinkage (15.43%) during the phase transition from Cu2In to Cu7In3.https://www.frontiersin.org/articles/10.3389/fmats.2021.658464/fulltransient liquid phase sinteringintermetallic compoundmicrostructure evolutionshear strengthporosity |
| spellingShingle | Bang Jiang Qiaoxin Zhang Lin Shi Chundong Zhu Chundong Zhu Zhiwen Chen Li Liu Yan Shi Microstructure Evolution and Shear Property of Cu-In Transient Liquid Phase Sintering Joints Frontiers in Materials transient liquid phase sintering intermetallic compound microstructure evolution shear strength porosity |
| title | Microstructure Evolution and Shear Property of Cu-In Transient Liquid Phase Sintering Joints |
| title_full | Microstructure Evolution and Shear Property of Cu-In Transient Liquid Phase Sintering Joints |
| title_fullStr | Microstructure Evolution and Shear Property of Cu-In Transient Liquid Phase Sintering Joints |
| title_full_unstemmed | Microstructure Evolution and Shear Property of Cu-In Transient Liquid Phase Sintering Joints |
| title_short | Microstructure Evolution and Shear Property of Cu-In Transient Liquid Phase Sintering Joints |
| title_sort | microstructure evolution and shear property of cu in transient liquid phase sintering joints |
| topic | transient liquid phase sintering intermetallic compound microstructure evolution shear strength porosity |
| url | https://www.frontiersin.org/articles/10.3389/fmats.2021.658464/full |
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