Microstructure Evolution and Shear Property of Cu-In Transient Liquid Phase Sintering Joints

Microstructure Evolution and Shear Property of Cu-In Transient Liquid Phase Sintering Joints

Transient liquid phase sintering (TLPS) is a promising joining technology that can achieve high temperature resistant solder joints at low temperature, showing excellent potential in power electronics. In this work, Cu/Cu-In/Cu solder joints were successfully prepared by TLPS process. The effects of...

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Bibliographic Details
Main Authors:	Bang Jiang, Qiaoxin Zhang, Lin Shi, Chundong Zhu, Zhiwen Chen, Li Liu, Yan Shi
Format:	Article
Language:	English
Published:	Frontiers Media S.A. 2021-06-01
Series:	Frontiers in Materials
Subjects:	transient liquid phase sintering intermetallic compound microstructure evolution shear strength porosity
Online Access:	https://www.frontiersin.org/articles/10.3389/fmats.2021.658464/full

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