Pak, A., Nanbakhsh, K., Hölck, O., Ritasalo, R., Sousa, M., Gompel, M. V., . . . Giagka, V. (2022). Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation. MDPI AG.
Чикаго-гийн эшлэл (17 дахь хэвлэлт)Pak, Anna, et al. Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation. MDPI AG, 2022.
MLA -ийн эшлэл (9 дэх хэвлэлт)Pak, Anna, et al. Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation. MDPI AG, 2022.
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