Pak, A., Nanbakhsh, K., Hölck, O., Ritasalo, R., Sousa, M., Gompel, M. V., . . . Giagka, V. (2022). Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation. MDPI AG.
Citação do estilo Chicago (17ª ed.)Pak, Anna, et al. Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation. MDPI AG, 2022.
Citação MLA (9ª ed.)Pak, Anna, et al. Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation. MDPI AG, 2022.
Nota: a formatação da citação pode não corresponder 100% ao definido pela respectiva norma.