APA引文

Pak, A., Nanbakhsh, K., Hölck, O., Ritasalo, R., Sousa, M., Gompel, M. V., . . . Giagka, V. (2022). Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation. MDPI AG.

Chicago Style (17th ed.) Citation

Pak, Anna, et al. Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation. MDPI AG, 2022.

MLA引文

Pak, Anna, et al. Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation. MDPI AG, 2022.