The Effect of Obliquely Sputtered Cu Underlayers with Different Thicknesses on the Magnetic Properties of 50 nm Ni<sub>80</sub>Fe<sub>20</sub> Thin Films

The Effect of Obliquely Sputtered Cu Underlayers with Different Thicknesses on the Magnetic Properties of 50 nm Ni<sub>80</sub>Fe<sub>20</sub> Thin Films

The magnetic properties of 50 nm Ni<sub>80</sub>Fe<sub>20</sub> deposited on Cu underlayers with different thicknesses by obliquely sputtering were studied. It was found that the in-plane uniaxial magnetic anisotropy (IPUMA) of the Ni<sub>80</sub>Fe<sub>20&l...

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Bibliographic Details
Main Authors:	Xiaoyu Li, Yunshi Jiang, Huan Yan, Tianming Li, Lu Zhang, Zhihong Zhang, Xian Guan, Min Chen, Jiaoyin Wang, Yihan Pu, Genzhai Peng, Mengjia Wang
Format:	Article
Language:	English
Published:	MDPI AG 2022-10-01
Series:	Magnetochemistry
Subjects:	obliquely sputtered Cu underlayer Ni<sub>80</sub>Fe<sub>20</sub> films dynamic magnetic properties damping factor
Online Access:	https://www.mdpi.com/2312-7481/8/10/134

Description
Summary:	The magnetic properties of 50 nm Ni<sub>80</sub>Fe<sub>20</sub> deposited on Cu underlayers with different thicknesses by obliquely sputtering were studied. It was found that the in-plane uniaxial magnetic anisotropy (IPUMA) of the Ni<sub>80</sub>Fe<sub>20</sub> film can be induced by the obliquely sputtered Cu underlayer deposited under the NiFe layer. The IPUMA field of NiFe film varies between 20 Oe and 40 Oe when the thickness of Cu underlayer varies from 5 nm to 50 nm. The permeability spectrum results show that the damping factor increases with increasing Cu underlayer thickness. This indicates that changing the thickness of the Cu underlayer of obliquely sputtering is an effective method to adjust the damping factor in the dynamic magnetization process of Ni<sub>80</sub>Fe<sub>20</sub> thin films.
ISSN:	2312-7481