Models of printed boards for solderless mounting of electronic components by foil perforation method
The paper presents models of printed circuit boards for an improved foil perforation method. The density of electrical connections of such printed circuit boards is estimated in comparison with circuit boards obtained using the methods of mounting in holes and surface mounting. The technological dif...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Politehperiodika
2017-10-01
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| Series: | Tekhnologiya i Konstruirovanie v Elektronnoi Apparature |
| Subjects: | |
| Online Access: | http://www.tkea.com.ua/tkea/2017/4-5_2017/pdf/01.pdf |
| _version_ | 1818177539248488448 |
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| author | Yefimenko A. A. Paliukh B. P. |
| author_facet | Yefimenko A. A. Paliukh B. P. |
| author_sort | Yefimenko A. A. |
| collection | DOAJ |
| description | The paper presents models of printed circuit boards for an improved foil perforation method. The density of electrical connections of such printed circuit boards is estimated in comparison with circuit boards obtained using the methods of mounting in holes and surface mounting. The technological differences in the manufacture of printed circuit boards for the foil perforation method and the traditional method are considered. |
| first_indexed | 2024-12-11T20:33:41Z |
| format | Article |
| id | doaj.art-a5c54c2f7f9440feba511cb93478c043 |
| institution | Directory Open Access Journal |
| issn | 2225-5818 2309-9992 |
| language | English |
| last_indexed | 2024-12-11T20:33:41Z |
| publishDate | 2017-10-01 |
| publisher | Politehperiodika |
| record_format | Article |
| series | Tekhnologiya i Konstruirovanie v Elektronnoi Apparature |
| spelling | doaj.art-a5c54c2f7f9440feba511cb93478c0432022-12-22T00:51:44ZengPolitehperiodikaTekhnologiya i Konstruirovanie v Elektronnoi Apparature2225-58182309-99922017-10-014-53910.15222/TKEA2017.4-5.03Models of printed boards for solderless mounting of electronic components by foil perforation methodYefimenko A. A.0Paliukh B. P. 1Ukraine, Odessa National Polytechnic UniversityUkraine, Odessa National Polytechnic UniversityThe paper presents models of printed circuit boards for an improved foil perforation method. The density of electrical connections of such printed circuit boards is estimated in comparison with circuit boards obtained using the methods of mounting in holes and surface mounting. The technological differences in the manufacture of printed circuit boards for the foil perforation method and the traditional method are considered.http://www.tkea.com.ua/tkea/2017/4-5_2017/pdf/01.pdfprinted circuit boardfoil puncture methodhole mounting methodsurface mounting |
| spellingShingle | Yefimenko A. A. Paliukh B. P. Models of printed boards for solderless mounting of electronic components by foil perforation method Tekhnologiya i Konstruirovanie v Elektronnoi Apparature printed circuit board foil puncture method hole mounting method surface mounting |
| title | Models of printed boards for solderless mounting of electronic components by foil perforation method |
| title_full | Models of printed boards for solderless mounting of electronic components by foil perforation method |
| title_fullStr | Models of printed boards for solderless mounting of electronic components by foil perforation method |
| title_full_unstemmed | Models of printed boards for solderless mounting of electronic components by foil perforation method |
| title_short | Models of printed boards for solderless mounting of electronic components by foil perforation method |
| title_sort | models of printed boards for solderless mounting of electronic components by foil perforation method |
| topic | printed circuit board foil puncture method hole mounting method surface mounting |
| url | http://www.tkea.com.ua/tkea/2017/4-5_2017/pdf/01.pdf |
| work_keys_str_mv | AT yefimenkoaa modelsofprintedboardsforsolderlessmountingofelectroniccomponentsbyfoilperforationmethod AT paliukhbp modelsofprintedboardsforsolderlessmountingofelectroniccomponentsbyfoilperforationmethod |