A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly
We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140 °C for 5 min. The wetting angle of the mixed solder joint is 17.55°. The overall atomic percent of Pb in the mixed solder joint is le...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-05-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/13/6/867 |
| _version_ | 1797484347232616448 |
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| author | Lingyao Sun Zhenhua Guo Xiuchen Zhao Ying Liu Kingning Tu Yingxia Liu |
| author_facet | Lingyao Sun Zhenhua Guo Xiuchen Zhao Ying Liu Kingning Tu Yingxia Liu |
| author_sort | Lingyao Sun |
| collection | DOAJ |
| description | We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140 °C for 5 min. The wetting angle of the mixed solder joint is 17.55°. The overall atomic percent of Pb in the mixed solder joint is less than 1%, which can be further reduced or eliminated. Moreover, after aging at 80 °C for 25 days, we observed no obvious decrease in shear strength of the fully mixed solder joint, which is the most advantage of this assembly technique over Sn58Bi solder assembly. The Bi phase segregation at the interface is slowed down compared with Sn-Bi solder joint. This low-temperature assembly is promising to be applied in advanced packaging technology to replace the eutectic Sn-Bi solder. |
| first_indexed | 2024-03-09T23:02:11Z |
| format | Article |
| id | doaj.art-a5fa96e9725445a1b6185dd0dd2f8efc |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-09T23:02:11Z |
| publishDate | 2022-05-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-a5fa96e9725445a1b6185dd0dd2f8efc2023-11-23T18:00:41ZengMDPI AGMicromachines2072-666X2022-05-0113686710.3390/mi13060867A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder AssemblyLingyao Sun0Zhenhua Guo1Xiuchen Zhao2Ying Liu3Kingning Tu4Yingxia Liu5School of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, ChinaSchool of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, ChinaSchool of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, ChinaSchool of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, ChinaDepartment of Materials Science and Engineering, City University of Hong Kong, Hong Kong, ChinaDepartment of Advanced Design and System Engineering, City University of Hong Kong, Hong Kong, ChinaWe successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140 °C for 5 min. The wetting angle of the mixed solder joint is 17.55°. The overall atomic percent of Pb in the mixed solder joint is less than 1%, which can be further reduced or eliminated. Moreover, after aging at 80 °C for 25 days, we observed no obvious decrease in shear strength of the fully mixed solder joint, which is the most advantage of this assembly technique over Sn58Bi solder assembly. The Bi phase segregation at the interface is slowed down compared with Sn-Bi solder joint. This low-temperature assembly is promising to be applied in advanced packaging technology to replace the eutectic Sn-Bi solder.https://www.mdpi.com/2072-666X/13/6/867low-temperature soldering3D ICBi aggregationSn-Bi solder |
| spellingShingle | Lingyao Sun Zhenhua Guo Xiuchen Zhao Ying Liu Kingning Tu Yingxia Liu A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly Micromachines low-temperature soldering 3D IC Bi aggregation Sn-Bi solder |
| title | A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly |
| title_full | A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly |
| title_fullStr | A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly |
| title_full_unstemmed | A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly |
| title_short | A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly |
| title_sort | new low temperature solder assembly technique to replace eutectic sn bi solder assembly |
| topic | low-temperature soldering 3D IC Bi aggregation Sn-Bi solder |
| url | https://www.mdpi.com/2072-666X/13/6/867 |
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